Research Catalog
Thick film technology and chip joining
- Title
- Thick film technology and chip joining [by] Lewis F. Miller.
- Author
- Miller, Lewis F.
- Publication
- New York, Gordon and Breach [c1972]
Items in the Library & Off-site
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | JSE 88-151 | Offsite |
Details
- Description
- 221 p. illus.; 24 cm.
- Series Statement
- Processes and materials in electronics, v. 1
- Subjects
- Bibliography (note)
- Includes bibliographical references.
- Call Number
- JSE 88-151
- ISBN
- 0677034407
- LCCN
- 79175344
- OCLC
- 447124
- NYPG88-B43932
- Author
- Miller, Lewis F.
- Title
- Thick film technology and chip joining [by] Lewis F. Miller.
- Imprint
- New York, Gordon and Breach [c1972]
- Series
- Processes and materials in electronics, v. 1
- Bibliography
- Includes bibliographical references.
- Research Call Number
- JSE 88-151