Research Catalog
Polymeric materials for electronics packaging and interconnection
- Title
- Polymeric materials for electronics packaging and interconnection / John H. Lupinski, editor, Robert S. Moore, editor.
- Publication
- Washington, DC : American Chemical Society, 1989.
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Details
- Additional Authors
- Description
- xi, 499 p. : ill.; 24 cm.
- Series Statement
- ACS symposium series ; 407
- Subjects
- Note
- "Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."
- Bibliography (note)
- Includes bibliographical references.
- Call Number
- JSE 89-1584
- ISBN
- 0841216797
- LCCN
- 89037412
- OCLC
- 20093030
- 20093030
- Title
- Polymeric materials for electronics packaging and interconnection / John H. Lupinski, editor, Robert S. Moore, editor.
- Imprint
- Washington, DC : American Chemical Society, 1989.
- Series
- ACS symposium series ; 407
- Bibliography
- Includes bibliographical references.
- Added Author
- Lupinski, John H., 1927-Moore, Robert S., 1933-American Chemical Society. Division of Polymeric Materials: Science and Engineering.American Chemical Society. Division of Polymer Chemistry.
- Research Call Number
- JSE 89-1584