Research Catalog
Ceramic substrates and packages for electronic applications
- Title
- Ceramic substrates and packages for electronic applications / edited by Man F. Yan ... [et al.].
- Publication
- Westerville, Ohio : American Ceramic Society, c1989.
Items in the Library & Off-site
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | JSE 91-535 | Offsite |
Details
- Additional Authors
- Description
- xi, 608 p. : ill.; 25 cm.
- Series Statement
- Advances in ceramics ; v. 26
- Subjects
- Note
- "Proceedings of the International Symposium on Ceramic Substrates and Packages, sponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan, held in Denver, CO, on October 18-21, 1987"--T.p. verso.
- Includes index.
- Bibliography (note)
- Includes bibliographical references.
- Call Number
- JSE 91-535
- ISBN
- 0916094359
- LCCN
- 89018365
- OCLC
- 20693019
- NYPG91-B31543
- Title
- Ceramic substrates and packages for electronic applications / edited by Man F. Yan ... [et al.].
- Imprint
- Westerville, Ohio : American Ceramic Society, c1989.
- Series
- Advances in ceramics ; v. 26
- Bibliography
- Includes bibliographical references.
- Added Author
- Yan, Man F.American Ceramic Society. Electronics Division.Yōgyō Kyōkai (Japan)
- Research Call Number
- JSE 91-535