Research Catalog
Electronics packaging forum
- Title
- Electronics packaging forum / edited by James E. Morris
- Publication
- New York, N.Y. : Van Nostrand Reinhold, 1990-
Items in the Library & Off-site
Filter by
2 Items
Status | Vol/Date | Format | Access | Call Number | Item Location |
---|---|---|---|---|---|
v. 2 | Text | Request in advance | JSK 91-95 v. 2 | Offsite | |
v. 1 | Text | Request in advance | JSK 91-95 v. 1 | Offsite |
Details
- Additional Authors
- Subject
- Note
- Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology
- Bibliography (note)
- Includes bibliographical references and indexes
- Call Number
- JSK 91-95
- ISBN
- 0442001789 (v. 1)
- OCLC
- 27328338
- 91-B70663
- Title
- Electronics packaging forum / edited by James E. Morris
- Imprint
- New York, N.Y. : Van Nostrand Reinhold, 1990-
- Bibliography
- Includes bibliographical references and indexes
- Added Author
- Morris, James E., 1944-State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division
- Research Call Number
- JSK 91-95 Library has: Vol. 1-2.