Research Catalog
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
- Title
- Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / [edited by] Michael Pecht.
- Publication
- New York : Wiley, c1994.
Items in the Library & Off-site
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| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | JSE 94-1207 | Offsite |
Details
- Additional Authors
- Pecht, Michael.
- Description
- xxxi, 426 p. : ill.; 25 cm.
- Subject
- Note
- "A Wiley-Interscience publication."
- Bibliography (note)
- Includes bibliographical references and index.
- Call Number
- JSE 94-1207
- ISBN
- 0471594466 (cloth : alk. paper)
- LCCN
- 93012475
- OCLC
- 27683155
- NYPG94-B21487
- Title
- Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / [edited by] Michael Pecht.
- Imprint
- New York : Wiley, c1994.
- Bibliography
- Includes bibliographical references and index.
- Added Author
- Pecht, Michael.
- Research Call Number
- JSE 94-1207