Research Catalog

Quality conformance and qualification of microelectronic packages and interconnects

Title
Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.].
Publication
New York : Wiley, c1994.

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Details

Additional Authors
Pecht, Michael.
Description
xxxiii, 461 p. : ill.; 25 cm.
Subject
  • Electronic packaging > Defects
  • Electronic packaging > Quality control
  • Electronic packaging > Testing
  • Quality assurance
Note
  • "A Wiley-Interscience publication."
Bibliography (note)
  • Includes bibliographical references (p. 419-450) and index.
Call Number
JSE 95-1391
ISBN
0471594369 (alk. paper)
LCCN
93009709
OCLC
27728002
Title
Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.].
Imprint
New York : Wiley, c1994.
Bibliography
Includes bibliographical references (p. 419-450) and index.
Added Author
Pecht, Michael.
Research Call Number
JSE 95-1391
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