Research Catalog
Technical survey - Copper Development Association.
- Title
- Technical survey - Copper Development Association.
- Author
- Copper Development Association.
- Publication
- Radlett [Eng.] Copper Development Association.
Items in the Library & Off-site
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1 Item
| Status | Vol/Date | Format | Access | Call Number | Item Location |
|---|---|---|---|---|---|
Not available - Please for assistance. | no. 2-13 (July 1953-Jan. 1959) | Text | Request in advance | VIA (Copper Development Association. Technical survey) no. 2-13 (July 1953-Jan. 1959) | Offsite |
Details
- Publication Date
- no. 1-13; Jan. 1953-Jan. 1959.
- Description
- 13 no.; 22 cm.
- Alternative Title
- Technical survey - Copper Development Association
- Subject
- Bibliography (note)
- Includes bibliographies.
- Linking Entry (note)
- Absorbed by: Copper, published 1957-66.
- Call Number
- VIA (Copper Development Association. Technical survey)
- ISSN
- 0574-007X
- LCCN
- sf 82005003
- OCLC
- 1565085
- Author
- Copper Development Association.
- Title
- Technical survey - Copper Development Association.
- Imprint
- Radlett [Eng.] Copper Development Association.
- Current Frequency
- Irregular
- Bibliography
- Includes bibliographies.
- Linking Entry
- Absorbed by: Copper, published 1957-66.
- Supersedes
- Copper and copper alloys
- Absorbed By
- Copper
- Research Call Number
- VIA (Copper Development Association. Technical survey) Library has: No. 1 (1953)-no. 13 (Jan. 1959).