Research Catalog

Proceedings of the 5th International Conference on Properties and Applications of Dielectric Materials, Seoul, Korea, May 25-30, 1997

Title
Proceedings of the 5th International Conference on Properties and Applications of Dielectric Materials, Seoul, Korea, May 25-30, 1997 / sponsored by IEEE Dielectrics and Electrical Insulation Society ; organized by the Korean Institute of Electrical and Electronic Material Engineers.
Author
International Conference on Properties and Applications of Dielectric Materials (5th : 1997 : Seoul, Korea)
Publication
[New York] : Institute of Electrical and Electronics Engineers Piscataway, NJ : IEEE Serviec Center, c1997.

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v. 2TextRequest in advance JSF 98-148 v. 2Offsite
v. 1TextRequest in advance JSF 98-148 v. 1Offsite

Details

Additional Authors
IEEE Dielectrics and Electrical Insulation Society.
Description
2 v. (xx, 1180 p.) : ill.; 29 cm.
Alternative Title
  • 1997 IEEE International Conference on Properties and Applications of Dielectric Materials
  • ICPADM'97
Subjects
Note
  • "97CH35794."
Bibliography (note)
  • Includes bibliographical references and index.
Call Number
JSF 98-148
ISBN
  • 0780326512 (softbound)
  • 0780326520 (casebound)
  • 0780326539 (microfiche )
OCLC
37752736
Conference
International Conference on Properties and Applications of Dielectric Materials (5th : 1997 : Seoul, Korea)
Title
Proceedings of the 5th International Conference on Properties and Applications of Dielectric Materials, Seoul, Korea, May 25-30, 1997 / sponsored by IEEE Dielectrics and Electrical Insulation Society ; organized by the Korean Institute of Electrical and Electronic Material Engineers.
Imprint
[New York] : Institute of Electrical and Electronics Engineers Piscataway, NJ : IEEE Serviec Center, c1997.
Bibliography
Includes bibliographical references and index.
Added Author
IEEE Dielectrics and Electrical Insulation Society.
Cover Title
1997 IEEE International Conference on Properties and Applications of Dielectric Materials
LCCN
95076252
Research Call Number
JSF 98-148
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