Research Catalog

Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler

Title
Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler / D.L. Rule, D.R. Smith, L.L. Sparks.
Author
Rule, D. L.
Publication
Boulder, Colo. : U.S. Dept. of Commerce, National Institute of Standards and Technology ; [Springfield, VA : Order from National Technical Information Service, 1990]

Details

Additional Authors
  • Smith, D. R.
  • Sparks, Larry L.
  • National Institute of Standards and Technology (U.S.)
Description
ix, 66 p. : ill.; 28 cm.
Series Statement
NISTIR ; 3948
Subject
  • Polyimides > Thermal properties
  • Aluminum oxide > Thermal properties
Note
  • Distributed to depository libraries in microfiche.
  • "August 1990."
Bibliography (note)
  • Includes bibliographical references (p. 65-66).
Funding (note)
  • Sponsored by SSC Laboratory.
Call Number
READEX Microfiche C 13.58:90-3948
OCLC
marcive28279574
Author
Rule, D. L.
Title
Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler / D.L. Rule, D.R. Smith, L.L. Sparks.
Imprint
Boulder, Colo. : U.S. Dept. of Commerce, National Institute of Standards and Technology ; [Springfield, VA : Order from National Technical Information Service, 1990]
Series
NISTIR ; 3948
Bibliography
Includes bibliographical references (p. 65-66).
Funding
Sponsored by SSC Laboratory.
Added Author
Smith, D. R.
Sparks, Larry L.
National Institute of Standards and Technology (U.S.)
Gpo Item No.
0247-D (MF)
Sudoc No.
C 13.58:90-3948
Research Call Number
READEX Microfiche C 13.58:90-3948
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