Research Catalog

Effects of thermal treatment on tensile creep and stress-rupture behavior on Hi-Nicalon SiC fibers

Title
Effects of thermal treatment on tensile creep and stress-rupture behavior on Hi-Nicalon SiC fibers [microform] / H.M. Yun, J.C. Goldsby, adn J.A. DiCarlo.
Author
Yun, H. M.
Publication
[Washington, D.C.] : National Aeronautics and Space Administration ; [Springfield, Va. : National Technical Information Service, distributor, 1995]

Details

Additional Authors
  • Goldsby, J. C.
  • DiCarlo, James A.
  • United States. National Aeronautics and Space Administration.
Description
1 v.
Series Statement
NASA technical memorandum ; 107087
Subject
  • Annealing
  • Creep properties
  • Creep rupture strength
  • Silicon carbides
  • Tensile creep
Note
  • Distributed to depository libraries in microfiche.
  • Shipping list no.: 96-0245-M.
Reproduction (note)
  • Microfiche.
Call Number
READEX Microfiche NAS 1.15:107087
OCLC
marcive34621587
Author
Yun, H. M.
Title
Effects of thermal treatment on tensile creep and stress-rupture behavior on Hi-Nicalon SiC fibers [microform] / H.M. Yun, J.C. Goldsby, adn J.A. DiCarlo.
Imprint
[Washington, D.C.] : National Aeronautics and Space Administration ; [Springfield, Va. : National Technical Information Service, distributor, 1995]
Series
NASA technical memorandum ; 107087
Reproduction
Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1995] 1 microfiche.
Added Author
Goldsby, J. C.
DiCarlo, James A.
United States. National Aeronautics and Space Administration.
Gpo Item No.
0830-D (MF)
Sudoc No.
NAS 1.15:107087
Research Call Number
READEX Microfiche NAS 1.15:107087
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