Research Catalog

Fatigue life prediction of solder joints in electronic packages with ANSYS

Title: Fatigue life prediction of solder joints in electronic packages with ANSYS / by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
Author: Madenci, Erdogan.
Publication: Boston : Kluwer Academic Publishers, c2003.

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Item details
Status	Format	Access	Call Number	Item Location
Request for On-site Use Request Scan How do I pick up this item and when will it be ready?	Text	Request in advance	JSE 03-244	Offsite
Request for On-site Use Request Scan How do I pick up this item and when will it be ready?	Text	By appointment only	*WSC-3030	Offsite

Additional Authors

Description

xx, 185 p. : ill.; 25 cm. +

Series Statement

The Kluwer international series in engineering and computer science ; SECS 719

Subject

Note

Call Number

JSE 03-244

ISBN

1402073305 (alk. paper)

LCCN

2002038928

OCLC

50773318

Author

Madenci, Erdogan.

Title

Fatigue life prediction of solder joints in electronic packages with ANSYS / by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

Imprint

Boston : Kluwer Academic Publishers, c2003.

Series

The Kluwer international series in engineering and computer science ; SECS 719

Added Author

Guven, Ibrahim.

Kilic, Bahattin.

Research Call Number

JSE 03-244 [Text]

*WSC-3030 [CD-ROM]