Research Catalog
Wafer bonding : applications and technology
- Title
- Wafer bonding : applications and technology / M. Alexe, U. Gösele (eds.).
- Publication
- Berlin ; New York : Springer-Verlag, c2004.
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| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | JSE 04-1202 | Offsite |
Details
- Additional Authors
- Description
- xv, 499 p. : ill. (some col.); 25 cm.
- Series Statement
- Springer series in materials science, 0933-033X ; 75
- Subjects
- Bibliography (note)
- Includes bibliographical references and index.
- Call Number
- JSE 04-1202
- ISBN
- 3540210490 (alk. paper)
- LCCN
- 2004046626
- OCLC
- 54692566
- Title
- Wafer bonding : applications and technology / M. Alexe, U. Gösele (eds.).
- Imprint
- Berlin ; New York : Springer-Verlag, c2004.
- Series
- Springer series in materials science, 0933-033X ; 75
- Bibliography
- Includes bibliographical references and index.
- Added Author
- Alexe, M. (Marin)Gösele, U.
- Research Call Number
- JSE 04-1202