Research Catalog

Inelastic strain analysis of solder joint in NASA fatigue specimen final report

Title
Inelastic strain analysis of solder joint in NASA fatigue specimen [microform] : final report / prepared by Abhijit Dasgupta, Chen Oyan.
Author
Dasgupta, Abhijit, 1954-
Publication
College Park, MD : University of Maryland ; [Greenbelt, MD] : NASA Goddard Space Flight Center, [1991]

Details

Additional Authors
  • Oyan, Chen.
  • University of Maryland, College Park.
  • Goddard Space Flight Center.
Description
1 v.
Series Statement
NASA-CR ; 187864
Uniform Title
NASA contractor report ; NASA CR-187864.
Subject
  • Strains and stresses
  • Solder and soldering
  • Creep analysis
  • Elastic properties
  • Fatigue (Materials)
  • Fatigue life
  • Finite element method
  • Plastic properties
  • Solders
  • Thermal cycling tests
  • Viscoplasticity
Reproduction (note)
  • Microfiche.
Call Number
GPO Microfiche NAS 1.26:187864
OCLC
marcive70140871
Author
Dasgupta, Abhijit, 1954-
Title
Inelastic strain analysis of solder joint in NASA fatigue specimen [microform] : final report / prepared by Abhijit Dasgupta, Chen Oyan.
Imprint
College Park, MD : University of Maryland ; [Greenbelt, MD] : NASA Goddard Space Flight Center, [1991]
Series
NASA-CR ; 187864
NASA contractor report ; NASA CR-187864.
Reproduction
Microfiche. [Washington, D.C.] : National Aeronautics and Space Administration, [1991]. 1 microfiche.
Added Author
Oyan, Chen.
University of Maryland, College Park.
Goddard Space Flight Center.
Gpo Item No.
0830-H-14 (MF)
Sudoc No.
NAS 1.26:187864
Research Call Number
GPO Microfiche NAS 1.26:187864
View in Legacy Catalog