Research Catalog

Bondability of Al-Si thin film in thermosonic gold wire bonding

Title
Bondability of Al-Si thin film in thermosonic gold wire bonding [microform] / Koichi Nakagawa ... [et al.].
Publication
Washington, D.C. : National Aeronautics and Space Administration, [1985]

Details

Additional Authors
  • Nakagawa, Koichi.
  • United States. National Aeronautics and Space Administration.
Description
1 v.
Series Statement
NASA technical memorandum ; NASA TM-77795
Uniform Title
NASA technical memorandum ; 77795.
Subject
  • Metal bonding
  • Integrated circuits
  • Metal films
  • Thin films
  • Wiring
Reproduction (note)
  • Microfiche.
Call Number
GPO Microfiche NAS 1.15:77795
OCLC
marcive243621361
Title
Bondability of Al-Si thin film in thermosonic gold wire bonding [microform] / Koichi Nakagawa ... [et al.].
Imprint
Washington, D.C. : National Aeronautics and Space Administration, [1985]
Series
NASA technical memorandum ; NASA TM-77795
NASA technical memorandum ; 77795.
Reproduction
Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1985]. 1 microfiche.
Added Author
Nakagawa, Koichi.
United States. National Aeronautics and Space Administration.
Gpo Item No.
0830-D (MF)
Sudoc No.
NAS 1.15:77795
Research Call Number
GPO Microfiche NAS 1.15:77795
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