Research Catalog

Title

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / Ryan Knight and Evan Cheng.

Author

Knight, Ryan

Publication

Adelphi, MD : Army Research Laboratory, September 2014.

Details

Additional Authors

• Cheng, Evan
• U.S. Army Research Laboratory, issuing body.

Description

1 online resource (v, 29 pages) : color illustrations.

Series Statement

ARL-TR ; 7094

Uniform Title

ARL-TR (Aberdeen Proving Ground, Md.) ; 7094.

Subject

• Microelectromechanical systems
• Microelectronic packaging
• Semiconductor wafers

Note

• Title from title screen (viewed Sept. 29, 2015).
• "September 2014."

Bibliography (note)

• Includes bibliographical references (page 26).

Type of Report (note)

• Final.

Call Number

GPO Internet D 101.133:7094

OCLC

marcive922548626

Author

Knight, Ryan, author.

Title

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / Ryan Knight and Evan Cheng.

Publisher

Adelphi, MD : Army Research Laboratory, September 2014.

Type of Content

text

Type of Medium

computer

Type of Carrier

online resource

Series

ARL-TR ; 7094

ARL-TR (Aberdeen Proving Ground, Md.) ; 7094.

Bibliography

Includes bibliographical references (page 26).

Type Of Report

Final.

Funding

ARL-TR-7094

Connect to:

https://purl.fdlp.gov/GPO/gpo61207

Added Author

Cheng, Evan, author.

U.S. Army Research Laboratory, issuing body.

Gpo Item No.

0324-A-01 (online)

Sudoc No.

D 101.133:7094