Research Catalog

Rhenium mechanical properties and joining technology

Title
Rhenium mechanical properties and joining technology / Brian D. Reed and James A. Biaglow.
Author
Reed, Brian D.
Publication
Cleveland, Ohio : National Aeronautics and Space Administration, Lewis Research Center, December 1996.

Available Online

https://purl.fdlp.gov/GPO/gpo70086

Details

Additional Authors
  • Biaglow, James A.
  • Lewis Research Center, issuing body.
  • United States. National Aeronautics and Space Administration, sponsoring body.
Description
1 online resource (12 pages) : illustrations.
Series Statement
NASA technical memorandum ; 107317
Uniform Title
NASA technical memorandum ; 107317.
Subject
  • Rhenium
  • Mechanical properties
  • Shear strength
  • Tensile strength
  • Metal joints
  • Metal bonding
Note
  • Title from title screen (viewed July 20, 2016).
  • "December 1996"--Report documentation page.
  • "Prepared for the 32nd Joint Propulsion Conference cosponsored by AIAA, ASME, SAE, and ASEE, Lake Buena Vista, Florida, July 1-3, 1996."
  • "Performing organization: National Aeronautics and Space Administration, Lewis Research Center"--Report documentation page.
  • "AIAA-96-2598."
Bibliography (note)
  • Includes bibliographical references (page 5).
Funding (note)
  • Sponsored by the National Aeronautics and Space Administration
Call Number
GPO Internet NAS 1.15:107317
OCLC
marcive953800999
Author
Reed, Brian D., author.
Title
Rhenium mechanical properties and joining technology / Brian D. Reed and James A. Biaglow.
Publisher
Cleveland, Ohio : National Aeronautics and Space Administration, Lewis Research Center, December 1996.
Type of Content
text
Type of Medium
computer
Type of Carrier
online resource
Series
NASA technical memorandum ; 107317
NASA technical memorandum ; 107317.
Bibliography
Includes bibliographical references (page 5).
Funding
Sponsored by the National Aeronautics and Space Administration WU-242-70-02 E-10413
Connect to:
https://purl.fdlp.gov/GPO/gpo70086
Added Author
Biaglow, James A., author.
Lewis Research Center, issuing body.
United States. National Aeronautics and Space Administration, sponsoring body.
Other Form:
Microfiche version: Reed, Brian D. Rhenium mechanical properties and joining technology (OCoLC)39715568
Gpo Item No.
0830-D (online)
Sudoc No.
NAS 1.15:107317
View in Legacy Catalog