Research Catalog
Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers
- Title
- Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers / Jörg Franke.
- Author
- Franke, Jörg (Prof. Dr.-Ing)
- Publication
- Munich ; Cincinnati, OH : Hanser, [2014]
Items in the Library & Off-site
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TK7874.53 .F7713 2014 | Off-site |
Holdings
Details
- Description
- xii, 356 pages : color illustrations; 25 cm
- Uniform Title
- Räumliche elektronische Baugruppen (3D-MID). English
- Alternative Title
- Räumliche elektronische Baugruppen (3D-MID).
- Subjects
- Note
- Translated from the German.
- Bibliography (note)
- Includes bibliographical references and index.
- ISBN
- 9781569905517 (hardcover)
- 1569905517 (hardcover)
- LCCN
- 2014006403
- 40023886654
- OCLC
- 876833155
- 2014006403
- SCSB-5770658
- Owning Institutions
- Columbia University Libraries