Research Catalog

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

Title
Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.
Publication
New York, N.Y. : The Society, [1991], ©1991.

Items in the Library & Off-site

Filter by

1 Item

StatusFormatAccessCall NumberItem Location
Request for On-site UseRequest Scan
How do I pick up this item and when will it be ready?
TextRequest in advance TK7870.15 .M35 1991Off-site

Details

Additional Authors
  • Chen, W. T.
  • Engel, Peter A.
  • Jahsman, W. E. (William E.)
  • American Society of Mechanical Engineers. Winter Annual Meeting (1991 : Atlanta, Ga.)
  • American Society of Mechanical Engineers. Applied Mechanics Division.
  • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Description
v, 153 pages : illustrations; 28 cm.
Series Statement
  • ADM ; vol. 131
  • EEP ; vol. 1
Uniform Title
  • ADM (Series) ; v. 131.
  • EEP (Series) ; v. 1.
Subject
  • Electronic packaging > Congresses
  • Microelectronic packaging > Congresses
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
0791808963
LCCN
91058586
OCLC
  • 25478092
  • ocm25478092
Owning Institutions
Columbia University Libraries