Research Catalog

Multichip modules : international conference and exhibition : 14-16 April 1993, Denver, Colorado

Title
Multichip modules : international conference and exhibition : 14-16 April 1993, Denver, Colorado / sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
Author
International Conference and Exhibition on Multichip Modules (2nd : 1993 : Denver, Colo.)
Publication
Bellingham, WA : Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, [1993], ©1993.

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Holdings

Details

Additional Authors
  • International Society for Hybrid Microelectronics.
  • International Electronics Packaging Society.
  • IEEE Components, Hybrids, and Materials Technology Section.
  • Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
Description
x, 604 pages : illustrations; 28 cm.
Series Statement
SPIE proceedings series ; v. 1986
Uniform Title
Proceedings of SPIE--the International Society for Optical Engineering ; v. 1986.
Subjects
Note
  • Papers from the Second International Conference and Exhibition on Multichip Modules.
Bibliography (note)
  • Includes bibliographical references.
ISBN
0930815378 (pbk.)
OCLC
  • 30032036
  • ocm30032036
Owning Institutions
Columbia University Libraries