Research Catalog
Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA
- Title
- Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA / Heng Ban [editor].
- Author
- International Thermal Conductivity Conference (33rd : 2017 : Logan, Utah)
- Publication
- Lancaster, PA : DEStech Publications, [2018]
Items in the Library & Off-site
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1 Item
Status | Format | Access | Call Number | Item Location |
---|---|---|---|---|
Text | Request in advance | QC320.8 .I58 2017g | Off-site |
Holdings
Details
- Additional Authors
- Description
- xi, 265 pages; 24 cm
- Subject
- Genre/Form
- Conference papers and proceedings.
- Bibliography (note)
- Includes bibliographical references and author index.
- ISBN
- 9781605955353
- 1605955353
- LCCN
- 99978515708
- OCLC
- 1086322634
- on1086322634
- SCSB-9258125
- Owning Institutions
- Columbia University Libraries