Research Catalog

Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA

Title
Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA / Heng Ban [editor].
Author
International Thermal Conductivity Conference (33rd : 2017 : Logan, Utah)
Publication
Lancaster, PA : DEStech Publications, [2018]

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Details

Additional Authors
  • Ban, Heng
  • International Thermal Expansion Symposium (21st : 2017 : Logan, Utah)
Description
xi, 265 pages; 24 cm
Subject
  • Heat > Conduction > Congresses
  • Heat > Methodology > Congresses
  • Materials > Thermal properties > Congresses
  • Materials > Methodology > Congresses
  • Expansion (Heat) > Congresses
  • Expansion (Heat) > Methodology > Congresses
  • Expansion (Heat)
  • Heat > Conduction
  • Materials > Thermal properties
Genre/Form
Conference papers and proceedings.
Bibliography (note)
  • Includes bibliographical references and author index.
ISBN
  • 9781605955353
  • 1605955353
LCCN
99978515708
OCLC
  • 1086322634
  • on1086322634
  • SCSB-9258125
Owning Institutions
Columbia University Libraries