Research Catalog

Title

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / [edited by] Michael Pecht.

Publication

New York : Wiley, [1994], ©1994.

Items in the Library & Off-site

Holdings

Details

Additional Authors

Pecht, Michael.

Description

xxxi, 426 pages : illustrations; 25 cm

Summary

• Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.
• Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins.

Subject

• Electronic packaging > Design
• Hybrid integrated circuits > Design and construction
• Multichip modules (Microelectronics) > Design and construction

Note

• "A Wiley-Interscience publication."

Bibliography (note)

• Includes bibliographical references and index.

Contents

1. Introduction -- 2. Design for Reliability Concepts -- 3. Starting the Design Process -- 4. Substrates -- 5. Wire and Wirebonds -- 6. Tape Automated Bonding -- 7. Flip-Chip Bonding -- 8. Attachment -- 9. Case -- 10. Leads -- 11. Lead Seals -- 12. Lid Seal and Lid.

ISBN

0471594466 (cloth : alk. paper)

LCCN

93012475

OCLC

• 27683155
• ocm27683155

Owning Institutions

Columbia University Libraries