Research Catalog

Title

Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993 / editors, Paul S. Ho, Che-Yu Li, Paul Totta.

Publication

New York : American Institute of Physics, [1994], ©1994.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Ho, P. S.
• Li, Che-Yu.
• Totta, Paul.

Description

vii, 302 pages : illustrations; 25 cm.

Series Statement

AIP conference proceedings ; no. 305

Uniform Title

AIP conference proceedings ; no. 305.

Subject

• Semiconductors > Defects > Congresses
• Metallic films > Congresses
• Thin film devices > Defects > Congresses
• Aluminum films > Congresses

Note

• "DOE CONF-9303142"--T.p. verso.

Bibliography (note)

• Includes bibliographical references and index.

Contents

• Direct Observation of the Growth and Movement of Electromigration Voids Under Passivation / T. N. Marieb, E. Abratowski, J. C. Bravman, M. Madden and P. Flinn -- Statistics of Stress Migration and Electromigration Failures of Passivated Interconnect Lines / M. A. Korhonen, P. Borgesen, D. D. Brown, C.-Y. Li, T. D. Sullivan and P. A. Totta -- Effects of Oxygen Addition During Al Deposition on Stress-Migration Induced Failure in Al Lines / H. Okabayashi and K. Aizawa -- X-Ray Determination of Strains, Stress, and Relaxation in Interconnect Metallizations / P. R. Besser and J. C. Bravman -- Thermal Stress and Plastic Deformation of Al Fine Line Structures: Effects of Oxide Confinement and Line Geometry / P. S. Ho, I.-S. Yeo, S. G. H. Anderson and C. K. Hu -- Predictive Modeling for Stress-Induced Void Formation in Al Lines / T. D. Sullivan -- Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress / M. Schneegans and G. M. Zorn.
• In-Situ, High Temperature X-Ray Stress Determination in Patterned, Passivated Al Interconnects / A. P. Clarke, S. Saimoto and P. Ho -- Analysis of Stress-Induced Void Nucleation and Growth in Passivated Interconnect Lines / A. F. Bower and L. B. Freund -- Characterization of Stress Migration in Sub-Micron Metal Interconnects / M. G. Fernandes, H. Kawasaki, J. L. Klein, D. Jawarani, R. Subrahmanyan, T.-K. Yu and F. Pintchovski -- Electromigration Reliability of AlCu Interconnects with W Studs / H. S. Rathore, R. G. Filippi, R. A. Wachnik, J. J. Estabil and T. Kwok -- Reliability of Single-Crystal Aluminum Lines and Its Limitation / H. Kaneko, T. Kawanoue, M. Hasunuma and M. Miyauchi -- Stages of Damage Formation by Electromigration in Line/Stud Structures / C. K. Hu, R. Rosenberg and K. N. Tu -- In-Situ Observation of Electromigration in Au Using Atomic Force Microscopy / M. Paniccia, R. Reifenberger and P. Flinn.
• Role of Evolved Stress in Electromigration Degradation / K. Hinode, T. Furusawa and Y. Homma -- Stress Evolution During Stress Migration and Electromigration in Passivated Interconnect Lines / P. Borgesen, M. A. Korhonen, D. D. Brown, C.-Y. Li, H. S. Rathore and P. A. Totta -- Modeling of Microstructures and Their Effect on Interconnect Reliability / H. J. Frost and C. V. Thompson -- Integrated Process Design Effects on the Mechanical Behavior of Layered Interconnects / C. D. Graas -- Prediction of Electromigration Lifetimes By Unit-Failure Model (UFM) in Al Stripes / J. H. Park, J. H. Chung, C. S. Park, S. I. Lee, J. K. Lee, M. Y. Lee and J. G. Lee -- Electromigration - Simulation and Experiment / M. Scherge.

ISBN

1563962519

LCCN

94070650

OCLC

ocm30564183

Owning Institutions

Columbia University Libraries