Research Catalog
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
- Title
- Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications / edited by Martin A. Schmidt ... [and others ; sponsored by the] Electronics and Dielectric Science and Technology divisions.
- Author
- International Symposium on Semiconductor Wafer Bonding (2nd : 1993 : Honolulu, Hawaii)
- Publication
- Pennington, NJ : Electrochemical Society, [1993], ©1993.
Items in the Library & Off-site
Filter by
1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TK7871.85 .I5838 1993g | Off-site |
Holdings
Details
- Additional Authors
- Description
- x, 485 pages : illustrations; 23 cm.
- Series Statement
- Proceedings (Electrochemical Society) ; v. 93-29
- Uniform Title
- Proceedings (Electrochemical Society) ; v. 93-29.
- Alternative Title
- Semiconductor wafer bonding: science, technology, and applications.
- Subjects
- Note
- Symposium held at the Hawaii meeting of The Electrochemical Society, May 16-21, 1993.
- Bibliography (note)
- Includes bibliographical references and indexes.
- ISBN
- 1566770688
- LCCN
- 93070070
- OCLC
- 29779238
- ocm29779238
- Owning Institutions
- Columbia University Libraries