Research Catalog

Title

Principles of plasma discharges and materials processing / Michael A. Lieberman, Allan J. Lichtenberg.

Author

Lieberman, M. A. (Michael A.)

Publication

New York : Wiley, [1994], ©1994.

Items in the Library & Off-site

Holdings

Details

Additional Authors

Lichtenberg, Allan J.

Description

xxvi, 572 pages : illustrations; 25 cm

Summary

• Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications - especially in the fabrication of integrated circuits.
• With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.

Subject

• Plasma dynamics
• Thin films > Surfaces
• Plasma etching
• Plasma chemistry

Note

• "A Wiley-Interscience publication."

Bibliography (note)

• Includes bibliographical references (p. 559-564) and index.

Contents

1. Introduction -- 2. Basic Plasma Equations and Equilibrium -- 3. Atomic Collisions -- 4. Plasma Dynamics -- 5. Diffusion and Transport -- 6. DC Sheaths -- 7. Chemical Reactions and Equilibrium -- 8. Molecular Collisions -- 9. Chemical Kinetics and Surface Processes -- 10. Particle and Energy Balance in Discharges -- 11. Capacitive Discharges -- 12. Inductive Discharges -- 13. Wave-Heated Discharges -- 14. DC Discharges -- 15. Etching -- 16. Deposition and Implantation -- A: Collision Dynamics -- B: The Collision Integral and Kinetic Theory -- C: Stochastic Heating in an Inductive Discharge.

ISBN

0471005770

LCCN

94028954

OCLC

• 30896011
• ocm30896011

Owning Institutions

Columbia University Libraries