Research Catalog

Title

Quality conformance and qualification of microelectronic packages and interconnects / editors, Michael Pecht [and others].

Publication

New York : Wiley, [1993], ©1993.

Items in the Library & Off-site

Holdings

Details

Additional Authors

Pecht, Michael.

Description

xxxiii, 461 pages : illustrations; 25 cm

Summary

• All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product.
• It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests.
• This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics.
• It does this with powerful techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data; physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product; and process controls that decrease variabilities in the end product and reduce end-of-line screening and testing.
• A wide range of microelectronic package and interconnect configurations for both single- and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail.
• The product of a distinguished team of authors and editors, this book's guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals.

Subject

• Electronic packaging > Defects
• Electronic packaging > Quality control
• Electronic packaging > Testing
• Quality assurance

Note

• "A Wiley-Interscience publication."

Bibliography (note)

• Includes bibliographical references (p. 419-450) and index.

Contents

1. Introduction -- 2. Three-dimensional Stacked Dies -- 3. Cofired Ceramic Substrates -- 4. Organic Laminated Substrates and Chip-on-board -- 5. High-density Interconnects and Deposited Dielectrics -- 6. Wire and Wirebonds -- 7. Tape Automated Bonds -- 8. Flip-chip Bonds -- 9. Device and Substrate Attachment -- 10. Cases -- 11. Leads -- 12. Lead Seals -- 13. Lid Seals -- 14. Material and Product Evaluation Methods -- 15. Rework Methods.

ISBN

0471594369 (alk. paper) :

LCCN

93009709

OCLC

ocm27728002

Owning Institutions

Columbia University Libraries