Research Catalog

Physical architecture of VLSI systems

Title
Physical architecture of VLSI systems / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.
Publication
New York : Wiley, [1994], ©1994.

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Additional Authors
  • Hannemann, Rob, 1925-
  • Kraus, Allan D.
  • Pecht, Michael.
Description
x, 887 pages : illustrations; 25 cm
Subject
  • Electronic packaging
  • Integrated circuits > Very large scale integration
  • Packaging
Note
  • "A Wiley-Interscience publication."
Bibliography (note)
  • Includes bibliographical references and indexes.
Contents
1. Introduction / Robert J. Hanneman -- 2. Semiconductor Packaging / Kenneth M. Brown -- 3. Interconnect Substrate Technologies / Iwona Turlik -- 4. Electronic Module Technology / Peter Sandborn and Dennis Herrell -- 5. Interassembly and Intersystem Interconnect / Robert S. Mroczkowski -- 6. Manufacturing Multichip Modules / Rakesh K. Agarwal and Michael Pecht -- 7. Electronic System Topology and Design / Douglas C. Schmidt -- 8. Electrical Design of Packaging Systems / Raj Mittra and Colin Gordon -- 9. Thermal Design and Control / Avram Bar-Cohen -- 10. Vibration and Shock Analysis / Fred Barez -- 11. Mechanical Design Methodologies in Electronic Packaging / Ephraim Suhir -- 12. Electronic Packaging Materials and Their Properties / Michael Pecht and Rakesh K. Agarwal -- 13. Reliability Issues / Michael Pecht.
ISBN
0471532991 (alk. paper)
LCCN
94010372
OCLC
ocm30109399
Owning Institutions
Columbia University Libraries