Research Catalog
Reliability related research on plastic IC-packages, a test chip approach : a research in the development of silicon test dies for measurement and comparison of molded IC-package reliability = Een onderzoek gericht op de ontwikkeling van silicum test-chips geschikt voor het meten en vergelijken van de bedrijfszekerheid van plastic IC omhullingen
- Title
- Reliability related research on plastic IC-packages, a test chip approach : a research in the development of silicon test dies for measurement and comparison of molded IC-package reliability = Een onderzoek gericht op de ontwikkeling van silicum test-chips geschikt voor het meten en vergelijken van de bedrijfszekerheid van plastic IC omhullingen / door Henricus Cornelis Josephus Maria van Gestel.
- Author
- Gestel, Henricus Cornelis Josephus Maria van.
- Publication
- Delft : Delft University Press, 1994.
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TK7870.15 .G47 1994g | Off-site |
Holdings
Details
- Description
- xii, 318 pages : illustrations; 24 cm
- Subjects
- Note
- Summary in Dutch.
- Thesis (note)
- Thesis (doctoral)--Technische Universiteit Delft, 1994.
- Bibliography (note)
- Includes bibliographical references (p. 283-302).
- Contents
- Ch. 1. Introduction To Plastic Packaging -- Ch. 2. Package-Related Reliability and Accelerated Testing -- Ch. 3. IC-Package Reliability Evaluation using On-Chip Test Structures -- Ch. 4. Modeling As a Tool For Failure Mechanism Evaluation -- Ch. 5. Silicon Stress Sensors as a Reliability Measurement Tool -- Ch. 6. Moisture Measurement as a Tool for Reliability Evaluation.
- ISBN
- 9062759602
- OCLC
- ocm32530896
- Owning Institutions
- Columbia University Libraries