Research Catalog

Title

Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications / edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim.

Publication

New York : Wiley, [1995], ©1995.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Pecht, Michael.
• Nguyen, Luu T.
• Hakim, Edward B.

Description

xxxiv, 474 pages : illustrations; 25 cm

Summary

• The past twenty years have seen many important advances in plastic encapsulated microelectronics (PEM) technology. Thanks to new packaging materials, improved design, increased reliability testing, and other important developments, PEMs are now perceived as a dependable and, in many cases, more cost-effective option for a wide range of electronic systems applications. Nevertheless, there continues to be a surprising death of authoritative references on the subject.
• Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.
• For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs - with special attention focusing on environment-specific applications.
• Plastic-Encapsulated Microelectronics is an indispensable resource for researchers and practicing mechanical and electrical engineers working in the electronics, aerospace, and automotive industries, in space agencies, or in the defense industry.

Subjects

• Microencapsulation
• Plastics in packaging
• Microelectronic packaging > Materials

Note

• "A Wiley-Interscience publication."

Bibliography (note)

• Includes bibliographical references and index.

Contents

• 1. Introduction. 1.1. What is a Plastic-Encapsulated Microcircuit? 1.2. Why Plastic Packages? -- 2. Plastic Packaging Materials. 2.1. Die Passivation. 2.2. Leadframe. 2.3. Die-Attach Materials. 2.4. Wirebond Materials. 2.5. Tape Automated Bonds. 2.6. Molding Compounds. 2.7. Characterization of Molding Compound Properties. 2.8. Other Encapsulants -- 3. Manufacturing Processes. 3.1. Leadframe Fabrication. 3.2. Die Attachment. 3.3. Wirebonding. 3.4. Tape Automated Bonding. 3.5. Encapsulation Process Technology. 3.6. Deflashing. 3.7. Lead Finish. 3.8. Lead Trimming and Forming. 3.9. Marking and Inspection -- 4. Assembly Onto Printed Wiring Boards. 4.1. Assembly Technologies. 4.2. Soldering. 4.3. Popcorning. 4.4. Solder Joint Fatigue. 4.5. Cleaning. 4.6. Conformal Coating -- 5. Packing and Handling. 5.1. Considerations in Packing and Handling. 5.2. Hierarchy of Packing. 5.3. Handling of Dry Packages. 5.4. Environmental Considerations -- 6. Failure Mechanisms, Sites, and Modes.
• 6.1. Classification of Failure Mechanisms. 6.2. Analysis of Failures. 6.3. Failure Accelerators. 6.4. Models for Failure Mechanisms. 6.5. Ranking of Potential Failures. 6.6. Comparison of Plastic and Ceramic Package Failure Modes -- 7. Quality Assurance. 7.1. Defects in Plastic-Encapsulated Microcircuits. 7.2. Screening. 7.3. Statistical Process Control -- 8. Qualification and Accelerated Testing. 8.1. The Qualification Process. 8.2. Tailoring to the Application. 8.3. Accelerated Testing. 8.4. Qualification Tests. 8.5. Continuous Qualification. 8.6. Industry Practices -- 9. Defect Analysis Techniques. 9.1. General Defect Analysis Procedures and Techniques. 9.2. Scanning Acoustic Microscopy. 9.3. X-Ray Microscopy. 9.4. Electron Microscopy. 9.5. Other Techniques. 9.6. Selection of Failure Analysis Techniques -- 10. Trends and Challenges. 10.1. Trends in Circuit Technology. 10.2. Trends in Materials, Design, and Fabrication. 10.3. Trends and Challenges in Circuit Card Assemblies.
• 10.4. Standards and Requirements.

ISBN

0471306258 (cloth : alk. paper)

LCCN

94046528

OCLC

• 31738522
• ocm31738522

Owning Institutions

Columbia University Libraries