Research Catalog
Optoelectronic packaging : 1-2 February, 1996, San Jose, California
- Title
- Optoelectronic packaging : 1-2 February, 1996, San Jose, California / Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; ooperating organization ARPA--Advanced Research projects Agency.
- Publication
- Bellingham, Wash., USA : SPIE, [1996], ©1996.
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| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TA1750 .O6712 1996g | Off-site |
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Details
- Additional Authors
- Description
- v, 196 pages : illustrations; 28 cm.
- Series Statement
- Proceedings / SPIE--the International Society for Optical Engineering ; v. 2691
- Uniform Title
- Proceedings of SPIE--the International Society for Optical Engineering ; v. 2691.
- Subjects
- Bibliography (note)
- Includes bibliographic references and index.
- Contents
- Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems / B. L. Booth -- Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems / L. C. West, C. W. Roberts, E. C. Piscani, M. Dubey, K. A. Jones and G. F. McLane -- MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging / J. P. Bristow, Y. Liu, T. Marta, K. Johnson, B. R. Hanzal, A. Peczalski, S. Bounnak, Y. S. Liu and H. S. Cole -- Coupling of VCSEL array into multimode polymer waveguides / J. K. Rowlette, Sr., M. K. Kallen, W. H. Lewis, J. D. Stack, T. M. Ward, C. Mueller and A. Plotts -- Applications ot circuit transfer technology to displays and optoelectronic devices / M. B. Spitzer, D.-P. Vu and R. P. Gale --
- Monolithic integration of refractive lenses with vertical-cavity lasers and detectors for optical interconnections / E. M. Strzelecka, G. B. Thompson, G. D. Robinson, M. G. Peters, B. J. Thibeault, M. Mondry, V. Jayaraman, F. H. Peters and L. A. Coldren -- Fluxless Sn-Ag solder ball formation for flip-chip application / B. R. Flachsbart and K.-C. Hsieh -- MACII optical connectors for printed circuit board input/output / A. G. Lubowe and T. P. Million -- Recent progress on silica-based optical switches and free-space optical switches / A. Himeno and M. Yamaguchi -- Optomechanical design of a robust free-space optical switching system / D. J. Reiley, J. M. Sasian and M. G. Beckman -- Alignment tolerancing of free-space MCM-to-MCM optical interconnects / D. E. Zaleta, S. K. Patra, V. H. Ozguz, J. Ma and S. H. Lee --
- rf optoelectronic transmitter and receiver arrays on silicon wafer boards / D. Yap, W. W. Ng, D. M. Bohmeyer, H. P. Hsu, H. W. Yen, M. J. Tabasky, A. J. Negri, J. Mehr, C. A. Armiento and P. O. Haugsjaa -- Micromachined silicon structures for single-mode passive alignment / H. Han, J. E. Schramm, J. Mathews and R. A. Boudreau -- Single-mode array optoelectronic packaging based on actively aligned planar optical waveguides / R. F. Kalman, E. R. Silva and D. F. Knapp -- Diffraction loss and optical crosstalk in hybrid receiver for free-space optical interconnections / C. Pusarla, A. Christou and D. W. Prather -- Universal detachable optical connector for military and commercial aerospace fiber optic modules / M. D. Orr, J. T. Hartley, M. W. Beranek, E. Y. Chan, H. E. Hager and C. S. Hong -- Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays / J. A. Neff --
- Thermal shift in the exciton absorption maxima as a function of the chip package design / D. B. Buchholz, A. L. Lentine and R. A. Novotny -- Thermal resistance of etched-pillar vertical-cavity surface-emitting laser diodes / T. Wipiejewski, M. G. Peters, D. B. Young, B. J. Thibeault, G. A. Fish and L. A. Coldren -- Modeling VCSEL characteristics using device and package models / N. D. Morozova and Y.-C. Lee.
- ISBN
- 0819420654
- LCCN
- 95072286
- OCLC
- ocm34705756
- Owning Institutions
- Columbia University Libraries