Research Catalog

Proceedings : 3rd International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 9-12, 1997

Title
Proceedings : 3rd International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 9-12, 1997 / co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology Society, Georgia Institute of Technology, Packaging Research Center (PRC).
Author
International Symposium on Advanced Packaging Materials (3rd : 1997 : Braselton, Ga.)
Publication
Reston, VA : IMAPS, [1997]

Items in the Library & Off-site

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StatusFormatAccessCall NumberItem Location
TextRequest in advance TK7870 .I586 1997gOff-site

Holdings

Details

Additional Authors
  • Tummala, Rao R., 1942-
  • International Microelectronics and Packaging Society.
  • Components, Packaging & Manufacturing Technology Society.
  • Georgia Institute of Technology. Packaging Research Center. 965/1: : pcc.
Description
viii, 183 pages : illustrations; 28 cm
Alternative Title
  • 3rd International Symposium on Advanced Packaging Materials
  • Third International Symposium on Advanced Packaging Materials
Subjects
Note
  • "IEEE Catalog Number: 97TH8263"--T.p. verso.
OCLC
  • 36899550
  • ocm36899550
Owning Institutions
Columbia University Libraries