Research Catalog
Electronic packaging of high speed circuitry
- Title
- Electronic packaging of high speed circuitry / Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, Jr.
- Author
- Konsowski, Stephen G.
- Publication
- New York : McGraw-Hill, [1997], ©1997.
Items in the Library & Off-site
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TK7870 .K647 1997 | Off-site |
Details
- Additional Authors
- Helland, Arden R.
- Description
- xxi, 445 pages : illustrations; 24 cm.
- Summary
- This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging.
- This state-of-the-art resource also provides you with practical design guidelines - plus information on the major issues of design verification and performance evaluation.
- Series Statement
- Electronic packaging and interconnection series
- Uniform Title
- Electronic packaging and interconnection series.
- Subjects
- Bibliography (note)
- Includes bibliographical references and index.
- Contents
- Ch. 1. High Speed Digital and Microwave Packaging -- Ch. 2. Fundamentals of Electricity and Magnetism Applied to Electromagnetics -- Ch. 3. Packaging Technologies for High Speed Digital and Microwave Circuits -- Ch. 4. Practical Design Details for Microwave Circuit Packaging -- Ch. 5. Microwave Circuit Assembly and Development -- Ch. 6. Transmission Lines: Effects and Analysis -- Ch. 7. Ideal Transmission Lines -- Ch. 8. Transmission-Line Interconnections: Loads and Ends -- Ch. 9. Signal Reflections, Bandwidth, and Losses -- Ch. 10. Transmission Lines: Reflection Diagrams -- Ch. 11. Transmission Lines: Signal Levels -- Ch. 12. Interconnections: Routing of Critical Signals -- Ch. 13. ECL Transmission Lines and Terminations -- Ch. 14. Differential Line Drivers and Terminations -- Appendix. Composites and Their Role in Electronic Packaging.
- ISBN
- 0070359709
- LCCN
- 97001904
- OCLC
- ocm36430582
- Owning Institutions
- Columbia University Libraries