Research Catalog

Title

Proceedings of the Third Symposium on Electrochemically Deposited Thin Films / editors, Milan Paunovic, Daniel A. Scherson.

Author

Symposium on Electrochemically Deposited Thin Films (1996 : San Antonio, Tex.)

Publication

Pennington, NJ : Electrochemical Society, [1997], ©1997.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Paunovic, Milan.
• Scherson, D. (Daniel)
• Electrochemical Society. Electrodeposition Division.
• Electrochemical Society. Physical Electrochemistry Division.

Description

ix, 310 pages : illustrations; 24 cm.

Series Statement

Proceedings : ; v. 96-19

Uniform Title

Proceedings (Electrochemical Society) ; v. 94-31.

Alternative Title

Electrochemically deposited thin films III

Subjects

• Electroplating > Congresses
• Electrochemical metallizing > Congresses
• Thin films > Materials > Congresses

Note

• "Electrodeposition and Physical Electrochemistry Divisions."

Bibliography (note)

• Includes bibliographical references and indexes.

Contents

• Statistical Aspects of Electrochemical 2D Nucleation and Growth / G. Staikov and W. J. Lorenz -- Electrocrystallization of Metals of High Tc Superconductor and Semiconductor Surfaces / R. T. Potzschke, A. Froese and W. Wiesbeck [et al.] -- Epitaxial CdSe Films Chemically Deposited on InP Single Crystals. Influence of the Growth Mechanism / H. Cachet, R. Cortes and M. Froment [et al.] -- Tapping Mode Atomic Force Microscopy Analysis of Electroless-Deposition Process / T. Homma, M. Tanabe and M. Suzuki [et al.] -- Electrodeposition Kinetics of Nickel Thin Films from a Nickel Sulfamate Bath Containing Copper Sulfate / N. Myung, P. T. A. Sumodjo and K. Nobe -- A New Solid State Electrodeposition Technique-Polarized Electrochemical Vapor Deposition / E. Z. Tang, T. H. Etsell and D. G. Ivey -- Electrochemistry of Sulfur Adlayers on Ag(111), (100), and (100) / D. W. Hatchett and H. S. White --
• Surface Development During Electroless Copper Deposition / C. J. Weber, H. W. Pickering and K. G. Well -- Ionic Mass Transfer Rate Associated with Electrodeposition of CdTe Film / Y. Fukunaka, S. Izuo and Z. Asaki [et al.] -- Deposition of Sn from Fluoride Solutions on Pd Predeposited Si(100) Substrate / C. Longo, P. T. A. Sumudjo and F. Sanz -- Differences between n and p-Type Substrates in the Electrochemical Platinum Deposition on Silicon / P. Gorostiza, R. Diaz and F. Sanz -- Electrodeposition of Copper under Micrograviti Conditions / Y. Fukunaka, K. Okano and Y. Tomii [et al.] -- Mathematical Modeling in Electrochemistry (An Overview) / M. Schlesinger -- Microstructural Aspects of Metal and Alloy Films Fabricated Electrochemically or by Sputter Deposition / D. Landolt -- Electrochemical Stepwise Formation of Metal Phases of Different Dimensionality / U. W. J. Lorenz and G. Staikov --
• Preparation and Properties of High Resistivity Electroless NiP Films / A. Iizuka, T. Higashikawa and T. Osaka -- Factors Influencing the Stability and Kinetics of Hydrous Ir Oxide Films / C. Bock and V. I. Birss -- Pore Ordering in Anodically Oxidized Aluminum Thin Films / J. Behnke, W. Ruythooren and T. Sands -- Characterization of NiFe Multilayers Plated in an Oscillating Flow / S. D. Leith and D. T. Schwartz -- Effects of Amines on the Electrodeposition of Ni-Fe Alloys / T. M. Harris and J. L. St. Clair -- Aqueous Electrodeposition of Rare Earth Thin Film Alloys With Ferrous Metals / L. Chen, M. Schwartz and K. Nobe -- Composite Films of Copper/Boron Nitride and Nickel/Boron Nitride / M. Hepel, T. Tannehill and C. Baxter -- Conformal Electroless Copper Deposition for sub-0.5 [mu]m Interconnect Wiring of Very High Aspect Ratio / S. Lopatin, Y. Shacham-Diamond and V. M. Dublin [et al.] --
• Process Development and Reliability Study of GFPdNi Finish for SC Packaging / I. Boguslavsky and J. A. Abys.

ISBN

1566771692

LCCN

97152280

OCLC

• 37115225
• ocm37115225

Owning Institutions

Columbia University Libraries