Research Catalog

Title

Multilevel interconnect technology : 1-2 October 1997, Austin, Texas / Divyesh N. Patel, Mart Graef, chairs/editors ; sponsored ... by SPIE--The International Society for Optical Engineering ; cooperating organizations, SEMI--Semiconductor Equipment and Materials International, Solid State Technology, [and] The Electrochemical Society.

Publication

Bellingham, Wash., USA : SPIE, [1997], ©1997.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Patel, Divyesh N.
• Graef, Mart.
• Society of Photo-optical Instrumentation Engineers.
• Semiconductor Equipment and Materials International.
• Solid State Technology.
• Electrochemical Society.

Description

vii, 132 pages : illustrations; 28 cm.

Series Statement

SPIE proceedings series ; v. 3214

Uniform Title

Proceedings of SPIE--the International Society for Optical Engineering ; v. 3214.

Subjects

• Production engineering > Congresses
• Electronic circuit design > Congresses
• Integrated circuits > Very large scale integration > Design and construction > Congresses
• Integrated circuits > Very large scale integration > Reliability > Congresses

Bibliography (note)

• Includes bibliographical references and index.

Contents

• Advanced PVD Ti/TiN liners for contact and via applications / H. J. Barth, J. Bierner and H. Helneder [et al.] -- Line length dependencies in interconnect optimization / D. Kadosh, M. Duane and Y. Lee -- Electroless Cu and barrier layers for subhalf-micron multilevel interconnects / S. Lopatin, Y. Shacham-Diamand and V. Dubin [et al.] -- Integrated arc suppression unit for defect reduction in PVD applications / X. Li, M. K. Narasimhan and V. Pavate [et al.] -- Correlation between aluminum alloy sputtering target metallurgical characteristics, arc initiation, and in-film defect intensity / V. Pavate, M. Abburi and S. Chiang [et al.] -- Thermal stability of PECVD W-B-N thin film as a diffusion barrier / Y. T. Kim, D. J. Kim and C. W. Lee [et al.] -- Productivity enhancement by replacing photoresist etchback by chemical mechanical polishing for interlayer dielectric planarization / K. Leitner, N. Elbel and K. Koller --
• Tungsten CMP process characterization for sub-0.35-[mu]m technology / C. Chia, J. Z. Zheng and W. D. Jiang [et al.] -- Low-pressure aluminum planarization for sub-0.5-[mu]m via holes / M. A. Biberger, D. Conci and J. Lyons [et al.] -- Study of wetting properties of Ti/TiN liners deposited by ion metal plasma PVD for low-temperature sub-0.25-[mu]m Al fill technology / S. Hui, K. Ngan and M. K. Narasimhan [et al.] -- Integration of low-k organic flowable SOG in a non-etchback/CMP process / G. Chou, A. S. R. Chen and W. Y. Hsieh -- Characterization of high-density plasma CVD USG film / W. Lu, J. Z. Zheng and J. Sudijuno [et al.] -- Novel MOCVD process for nanoscale dielectric and ferroelectric thin films / T. Li, P. A. Zawadzki and R. A. Stall -- Statistical design of experimental analysis of TiN films deposited by ion metal plasma PVD for sub-0.25-[mu]m IC process applications / S. Hui, K. Ngan and M. K. Narasimhan [et al.] --
• Plasma-induced metal sidewall undercut and its dependence on the layout geometry / D. Y. Hu, A. Q. Zhang and J. Xie [et al.] -- Removal of surface oxide from electrical test (E-test) pads using an argon sputter etch procedure to recover TAB wafers / T. A. Petersen-Buchheit, W. R. Johannes and D. N. Patel [et al.].

ISBN

081942546X

OCLC

• 37743176
• ocm37743176

Owning Institutions

Columbia University Libraries