Research Catalog

Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Title
Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.
Publication
New York, N.Y. : American Society of Mechanical Engineers, [1997], ©1997.

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Additional Authors
  • Chen, William T.
  • Read, D. T.
  • American Society of Mechanical Engineers. Applied Mechanics Division.
  • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
  • International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.)
Description
vi, 193 pages : illustrations; 28 cm.
Series Statement
  • AMD ; vol. 222
  • EEP ; vol. 20
Uniform Title
  • AMD (Series) ; v. 222.
  • EEP (Series) ; v. 20.
Subject
  • Electronic packaging > Congresses
  • Fracture mechanics > Congresses
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
0791818276
LCCN
97076706
OCLC
ocm38095948
Owning Institutions
Columbia University Libraries