Research Catalog

Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Title
Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.
Publication
New York : American Society of Mechanical Engineers, [1995], ©1995.

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TextRequest in advance TK7870.15 .S46 1995gOff-site

Details

Additional Authors
  • Ume, Charles.
  • Chao, Pin-Yeh.
  • American Society of Mechanical Engineers. Manufacturing Engineering Division.
  • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
  • International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
Description
v, 123 pages : illustrations; 28 cm.
Series Statement
  • MED ; vol. 3
  • EEP ; vol. 14
Uniform Title
  • MED (Series) ; v. 3.
  • EEP (Series) ; v. 14.
Subjects
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
0791817407
LCCN
95081274
OCLC
  • 33974126
  • ocm33974126
Owning Institutions
Columbia University Libraries