Research Catalog
Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
- Title
- Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.
- Publication
- New York : American Society of Mechanical Engineers, [1995], ©1995.
Items in the Library & Off-site
Filter by
1 Item
Status | Format | Access | Call Number | Item Location |
---|---|---|---|---|
Text | Request in advance | TK7870.15 .S46 1995g | Off-site |
Holdings
Details
- Additional Authors
- Description
- v, 123 pages : illustrations; 28 cm.
- Series Statement
- MED ; vol. 3
- EEP ; vol. 14
- Uniform Title
- MED (Series) ; v. 3.
- EEP (Series) ; v. 14.
- Subjects
- Bibliography (note)
- Includes bibliographical references and index.
- ISBN
- 0791817407
- LCCN
- 95081274
- OCLC
- 33974126
- ocm33974126
- Owning Institutions
- Columbia University Libraries