Research Catalog

Electronic packaging materials and their properties

Title: Electronic packaging materials and their properties / Michael G. Pecht [and others].
Publication: Boca Raton : CRC Press, [1999], ©1999.

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Status	Format	Access	Call Number	Item Location
Request for On-site Use Request Scan How do I pick up this item and when will it be ready?	Text	Request in advance	TK7870.15 .E4222 1999	Off-site

Holdings

Details

Additional Authors

Pecht, Michael.

Description

114 pages : illustrations; 25 cm.

Series Statement

The electronic packaging series

Uniform Title

Electronic packaging series.

Subject

Electronic packaging > Materials

Bibliography (note)

Includes bibliographical references (p. 109-112) and index.

Contents

1. Properties of electronic packaging materials. 1.1. Electrical properties. 1.2. Thermal and thermomechanical properties. 1.3. Mechanical properties. 1.4. Chemical properties. 1.5. Miscellaneous properties -- 2. Zeroth-level packaging materials. 2.1. Semiconductors. 2.2. Attachment materials. 2.3. Substrates materials -- 3. First-level packaging materials. 3.1. Wire interconnects. 3.2. Tape interconnects. 3.3. Case materials. 3.4. Lid seals. 3.5. Leads -- 4. Second-level packaging materials. 4.1. Reinforcement fiber materials. 4.2. Resins. 4.3. Laminates. 4.4. Constraining cores. 4.5. Flexible wiring board materials. 4.6. Conformal coatings -- 5. Third-level packaging materials. 5.1. Backpanel materials. 5.2. Connector materials. 5.3. Cables and flex circuit materials -- 6. Summary.

ISBN

0849396255 (alk. paper)

LCCN

98034479

OCLC

ocm39485340

Owning Institutions

Columbia University Libraries