Research Catalog

Title

Stress induced phenomena in metallization : fifth international workshop, Stuttgart, Germany, June, 1999 / editors, Oliver Kraft, Eduard Arzt, Cynthia A. Volkert.

Publication

Woodbury, N.Y. : American Institute of Physics, [1999], ©1999.

Items in the Library & Off-site

Holdings

Details

Additional Authors

International Workshop on Stress-Induced Phenomena in Metallization (5th : 1999 : Stuttgart, Germany)

Description

ix, 318 pages : illustrations; 25 cm.

Series Statement

AIP conference proceedings ; 491

Uniform Title

AIP conference proceedings ; no. 491.

Subjects

• Semiconductors > Defects > Congresses
• Metallic films > Congresses
• Aluminum films > Congresses
• Liquid crystal devices > Defects > Congresses
• Electrochemical metallizing > Congresses
• Thin film devices > Defects > Congresses
• Integrated circuits > Defects > Congresses
• Acoustic surface wave devices > Defects > Congresses
• Electrodiffusion > Congresses

Contents

• Electromigration Early Failure Distribution in Submicron Interconnects / M. Gall, P. S. Ho and C. Capasso / [et al.] -- Direct Measurement of Nucleation Times and Growth Rates of Electromigration Induced Voids / J. C. Doan, J. C. Bravman and P. A. Flinn / [et al.] -- Electromigration in Aluminum Damascene Lines / R. F. Schnabel, R. Filippi and L. M. Gignac / [et al.] -- Reliability Considerations for Copper Metallizations in ULSI Circuits / T. D. Sullivan -- Electromigration Modeling for Design Rule Development in Microelectronic Interconnects / R. J. Gleixner, W. K. Meyer and W. D. Nix -- Modeling and Experimental Characterization of Electromigration in Interconnect Trees / C. V. Thompson, S. P. Hau-Riege and V. K. Andleigh -- Diffusion-Induced Stresses / D. L. Beke, G. Opposits and I. A. Szabo -- In Situ Study of Interconnect Failures by Electromigration Inside a Scanning Electron Microscope / K. Wetzig, H. Wendrock and A. Buerke / [et al.] --
• Model Studies of Electromigration Using Indented Single-Crystal Aluminum Lines / Y.-C. Joo, S. P. Baker and E. Arzt / [et al.] -- Local Strain Measurements during Electromigration / P.-C. Wang, G. S. Cargill III and C.-K. Hu -- Alloying Effects in Electromigration: What Controls the Electromigration Drift? / R. Spolenak, O. Kraft and E. Arzt -- Multiprobe Resistance Monitoring of Blech Pattern during Electromigration Testing / S. Shingubara, T. Osaka and H. Sakaue / [et al.] -- 3-D Finite Element Simulator for Migration Effects due to Various Driving Forces in Interconnect Lines / S. Rzepka, E. Meusel and M. A. Korhonen / [et al.] -- In Situ Electromigration Damage in Al Interconnect Lines in the SEM and the Influence of Grain Orientation / A. Buerke, H. Wendrock and K. Wetzig -- Effect of Grain Boundary/Interface Network on Cavity Growth under Interacted Migration Induced by Stress and Electric Current / T. Kitamura and T. Shibutani --
• Stress-Induced and Electromigration Voiding in Nitride Passivated Al Interconnects / S.-H. Lee, S. Lee and J. C. Bravman / [et al.] -- In-Situ Studies of Electromigration Voiding in Passivated Copper Interconnects / N. E. Meier, T. N. Marieb and P. A. Flinn / [et al.] -- Molecular Dynamic Simulation of Grain Boundary Diffusivities and Vacancy Behavior in Al / T. Shinzawa -- Nucleation, Growth, Interduffusion, and Adhesion of Metal Films on Polymers / F. Faupel, A. Thran and V. Zaporojtchenko / [et al.] -- Thermoclastic Analysis of Thin Lines on Substrates / P. Gudmundson and A. Wikstrom -- Mechanical Strains and Stresses in Aluminum and Copper Interconnect Lines for 0.18 [mu]m Logic Technologies / P. R. Besser -- Anelastic Contributions to the Behavior of Freestanding Al Thin Films / R. P. Vinci, G. Cornella and J. C. Bravman -- Stress in Electrochemically Deposited Copper / S. H. Brongersma, E. Richard and I. Vervoort / [et al.] --
• Microstructural Analysis of Al Interconnects in Microprocessor Devices Using EFTEM / H.-J. Engelmann, W. Blum and E. Zschech -- Quantitative Texture Analysis of Cu Damascene Interconnects / A. Huot, A. H. Fischer and A. von Glasow / [et al.] -- Stress Relaxation and Creep in Freestanding Thin Al Films Studied Using a Bulge Tester / A. J. Kalkman, A. H. Verbruggen and G. C. A. M. Janssen -- Grain Growth and Twinning in Copper Thin Films for ULSI Circuits / T. Kotter, H. Wendrock and H. Schloerb / [et al.] -- Stress and Plasticity in Passivated Interconnect Lines / H. Nielen, H. Gobel and I. Eppler / [et al.] -- Stress and Plasticity in Cu Thin Films / V. Weihnacht and W. Bruckner -- Analysis of Local Strain in Aluminum Interconnects by Convergent Beam Electron Diffraction / S. Kramer and J. Mayer -- A Finite Element Study of Thermal Stress in Copper Interconnect / P. Su, S. Rzepka and M. A. Korhonen / [et al.] --
• Thermal Stresses in Cu and Damascene Submicron Line Structures / J. Kasthurirangan, Y. Du and P. Ho / [et al.].

ISBN

1563969041

LCCN

99460336

OCLC

ocm42866326

Owning Institutions

Columbia University Libraries