Research Catalog

Title

In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing II : 23-24 September, 1998, Santa Clara, California / Sergio Ajuria, Tim Z. Hossain, chairs/editors ; sponsored and published by SPIE--The International Society for Optical Engineering ; cooperating organizations, Solid State Technology [and others].

Publication

Bellingham, Washington : SPIE, [1998], ©1998.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Ajuria, Sergio.
• Hossain, Tim Z.
• Society of Photo-optical Instrumentation Engineers.
• Solid State Technology (Organization)

Description

ix, 244 pages : illustrations; 28 cm.

Series Statement

SPIE proceedings series ; v. 3509

Uniform Title

Proceedings of SPIE--the International Society for Optical Engineering ; v. 3509.

Subject

• Integrated circuits > Design and construction > Congresses
• Semiconductors > Design and construction > Congresses
• Optical pattern recognition > Congresses
• Manufacturing processes > Congresses

Bibliography (note)

• Includes bibliographical references and author index.

Contents

• Microprocessor technology challenges through the next decade / G. E. Sery -- Copper chip technology / D. C. Edelstein -- Foundry technology trend / J. Y.-C. Sun -- Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below / A. S. Harrus, J. Kelly and R. A. Powell -- Value added with in-line electrical characterization: fact or fiction? / S. R. Weinzierl and T. E. Turner -- Correlating EEPROM end-of-line measurements with PDM in-line charging monitoring for ion implantation / A. S. Bloot, E. H. J. Satink and A. Cacciato [et al.] -- Scanning capacitance microscope, an in-line nondestructive technique for SiO[subscript 2] characterization / F. Bordoni, R. De Tommasis and A. Di Giacomo [et al.] -- Scanning auger microscopy studies of microelectronic features / S. Santucci, L. Lozzi and D. Pacifico [et al.] -- Enhanced defect detection capability using combined brightfield/darkfield imaging / M. M. Altamirano and A. Skumanich --
• Silicon wafer subsurface characterization with blue-laser/microwave and UV-laser/millimeter-wave photoconductivity techniques / Y.-I. Ogita, H. Shinohara and T. Sawanobori [et al.] -- Compact FTIR wafer-state sensors: a new way of in-line ULSI characterization / V. A. Yakovlev, S. Charpenay and M. Richter [et al.] -- Optical fiber profilometer with submicronic accuracy / Y. Alayli, D. Wang and M. Bonis -- In-line x-ray fluorescence metrology of metals and ultrathin barrier layers for ULSI applications / Y. Y. Shacham-Diamand, B. Yokhin and I. Mazor [et al.] -- Basic approaches for metal-induced oxide charge on silicon wafer surfaces studied by AC surface photovoltage techniques / H. Shimizu and C. Munakata -- Noncontact COS charge analysis for in-line monitoring of wet cleaning processes / X. Zhang, M. Juang and S. Tai [et al.] --
• Noncontact surface potential measurements for charging reduction during TEOS deposition and ion implantation / A. Cacciato, P. Schumbera and A. Heessels [et al.] -- Contact potential difference methods for full wafer characterization of Si/SiO[subscript 2] interface defects induced by plasma processing / P. Edelman, A. Savchouk and M. Wilson [et al.] -- Comparison study of lifetime measurement techniques / G. G. Quinones and E. L. Allen -- Plasma damage monitoring for PECVD deposition: a contact potential difference study and device yield analysis / Z. Xu, C. Bencher and M. Le [et al.] -- Phosphorous-outgassing-induced threshold voltage in p-channel power MOSFET devices / F. Lin, R. De Souza and R. Dynes [et al.] -- Metal layer process characterization: statistical and computation methods for handling, interpreting, and reacting to in-line critical dimension information / J. Oey, P. F. Mack and C. A. Mack --
• In-line inspection optimization using a yield management system / F. Mizuno and S. Isogai -- Novel method to quantify defect-limited yield loss mechanisms on a mixed-mode analog/digital process / S. Healy -- Strategy for a flexible and inexpensive defect density line monitoring for microchip manufacturing / F. Kiel, O. Andrianaivo-Golz and D. Solomon [et al.] -- Locating defects on wafers for analysis by SEM/EDX, AFM, and other microanalysis techniques / P. D. Kinney and Yu. Uritsky -- Characterization and control of the laser microsoldering process for solid solder deposits using pyrometry / H.-J. Pucher and M. Fleckenstein -- TOF-SIMS: a tool for material characterization, process control, and improvement in a wafer fab / P. Fiorani, G. Margutti and G. Mariani [et al.] -- Technique to analyze large-area surface roughness of a wafer using TXRF / B. Noack and T. Z. Hossain -- Investigation of rod-like defects in MOS 12 / R. Goodner, P. Wang and F. Lee [et al.].

ISBN

0819429686

LCCN

99194426

OCLC

ocm39869199

Owning Institutions

Columbia University Libraries