Research Catalog

Title

Multilevel interconnect technology II : 23-24 September, Santa Clara, California / Mart Graef, Divyseh N. Patel, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, Solid State Technology [and others].

Publication

Bellingham, Washington : SPIE, [1998], ©1998.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Graef, Mart.
• Patel, Divyesh N.
• Society of Photo-optical Instrumentation Engineers.
• Solid State Technology (Organization)
• Electrochemical Society.
• American Vacuum Society.

Description

vii, 224 pages : illustrations; 28 cm.

Series Statement

Proceedings / SPIE--the International Society for Optical Engineering ; v. 3508

Uniform Title

Proceedings of SPIE--the International Society for Optical Engineering ; v. 3508.

Subject

• Integrated circuits > Design and construction > Congresses
• Plasma etching > Congresses
• Metallizing > Congresses
• Dielectric films > Congresses

Bibliography (note)

• Includes bibliographical references and author index.

Contents

• Microprocessor technology challenges through the next decade / G. E. Sery -- Copper chip technology / D. C. Edelstein -- Foundry technology trend / J. Y.-C. Sun -- Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below / A. S. Harrus, J. Kelly and R. A. Powell -- Damascene Cu-interconnect formation in benzocyclobuten (BCB) film using a novel end-point monitoring technique / Y. Hayashi, T. Onodera and S. Saitoh [et al.] -- Integration of hydrogen silsesquioxane into an advanced BiCMOS process / M. Olewine, R. Wall and G. J. Colovos -- Control of the interaction of metals with fluorinated silicon oxides / S. E. Kim, C. Steinbruchel and A. Kumar [et al.] -- IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects / I. Hashim, V. Pavate and P. Ding [et al.] --
• Thin electroless barrier for copper films / S. D. Lopatin, Y. Y. Shacham-Diamand and V. M. Dubin [et al.] -- Novel AlCu: fill process for via applications / H. Helneder, M. Schneegans and K. Schober [et al.] -- Explosive phenomenon of AlCu/TiN and W-plugs multilevel interconnect system / J. D. Yang, C. A. Lin and Y. T. Yen [et al.] -- Applications of Forcefill aluminum for contact and via metallization / J. Forster, W. Robl and N. Rausch [et al.] -- 0.50-[mu]m pitch metal integration in 0.18-[mu]m technology / J. R. D. DeBord, V. Jayaraman and M. M. Hewson [et al.] -- Integration of a W-plug in an Al-based metallization scheme for 0.25-[mu]m IC technology / S. S. Sengupta and S. Bothra -- Inorganic bottom ARC SiOxNy for interconnection levels on 0.18-[mu]m technology / Y. Trouiller, N. Buffet and T. Mourier [et al.] -- Introduction to 300-mm/0.18-[mu]m to 0.13-[mu]m clean CMP system / M. Tsujimura --
• Chemical mechanical polishing: future processes require CMP tool flexibility / F. A. T. Schraub, J. Boyd and J. Valentine [et al.] -- Copper post-CMP cleaning process on a dry-in/dry-out tool / S. Basak, M. Grief and A. Gupta [et al.] -- Improved post-etch cleaning of dual-damascene system for 0.18-[mu]m technology / D. Louis, C. Peyne and E. Lajoinie [et al.] -- Characterization of pattern density and the metal stack composition on chlorine residues from the metal etch process / S. Y. Loong, H. K. Lee and M. S. Zhou [et al.] -- Post-etching polymer removal in sub-half-micron device technology / S. Y. M. Chooi, Z. Ismail and P.-Y. Ee [et al.] -- Titanium silicide etching in sub-half-micron device technology / S. Y. M. Chooi, V. K. T. Sih and S.-Y. Siah [et al.] -- Etching of dual-damascene oxide structures in a medium-density oxide etch reactor / E. Wagganer, G. Mueller and S. F. Clark [et al.] --
• Effects of post-treatment for low-dielectric hydrogen silsesquioxane (HSQ) / T. C. Chang, P. T. Liu and M. F. Chou [et al.] -- Novel two-step Al CMP process for overcoming pattern geometry effects / M.-S. Tsai, J.-S. Lin and B.-T. Dai.

ISBN

0819429678

LCCN

99196349

OCLC

ocm39930528

Owning Institutions

Columbia University Libraries