Research Catalog

Title

Process, equipment, and materials control in integrated circuit manufacturing IV : 22-24 September, 1998, Santa Clara, California / Anthony J. Toprac, Kim Dang, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, Solid State Technology [and others].

Publication

Bellingham, Washington : SPIE, [1998], ©1998.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Toprac, Anthony J. (Anthony John), 1955-
• Dang, Kim.
• Society of Photo-optical Instrumentation Engineers.
• Solid State Technology (Organization)

Description

vii, 322 pages : illustrations; 28 cm.

Series Statement

Proceedings / SPIE--the International Society for Optical Engineering ; v. 3507

Uniform Title

Proceedings of SPIE--the International Society for Optical Engineering ; v. 3507.

Subject

• Integrated circuits > Design and construction > Congresses
• Plasma etching > Congresses
• Metallizing > Congresses
• Dielectric films > Congresses

Bibliography (note)

• Includes bibliographical references and index.

Contents

• Microprocessor technology challenges through the next decade / G. E. Sery -- Copper chip technology / D. C. Edelstein -- Foundry technology trend / J. Y.-C. Sun -- Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below / A. S. Harrus, J. Kelly and R. A. Powell -- Methodology for real-time feedback variable selection for manufacturing process control: theoretical and simulation results / O. D. Patterson and P. P. Khargonekar -- Fast-ramp rapid vertical processor for 300-mm Si wafer processing / C. Porter, A. Laser and R. Herring [et al.] -- Development and testing of an active platen for IC manufacturing / J. M. Redmond, P. Barney and T. G. Smith [et al.] -- Multivariate run-to-run control of arm-to-arm variations in chemical mechanical planarization / W. J. Campbell, C. Raeder and V. Wenner [et al.] -- Feedforward recipe selection control design software / S. Ruegsegger, A. Wagner and J. S. Freudenberg [et al.] --
• More-effective troubleshooting using data collection on etch equipment: case studies / J. Durham, S. Felker and S. Shelton -- Monitoring of a RTA process using multi-PCA / M. L. Miller, Q. Wang and T. Riley -- Dynamic gas chemistry simulator for vacuum systems / J. Durham and S. Felker -- Chemical rate model for the surface pyrolysis of tetrakis(dimethylamido)titanium to form titanium nitride films / A. J. Toprac, J. A. Iacoponi and K. A. Littau -- Mechanism for QBD failure in poly gates / J. A. Barker, R. Wu and R. G. Cosway [et al.] -- Plasma etching of aluminum copper tungsten on titanium nitride and titanium / K. Dang -- Influence of topographical variations on reliable via and contact formation / J. T. Healey and S. E. Rubel -- Flat-type metal residue-induced metal line bridge / H. C. Hsiao, P. T. Chu and Y. M. Hsu [et al.] -- SVG 8800 photoresist coater uniformity improvement using Shipley resist 3010 / D. Emielita --
• Etch characteristics of Ti in Cl[subscript 2]/N[subscript 2] and TiN in Cl[subscript 2]/N[subscript 2]/BCl[subscript 3] plasmas by response surface methodology / N. M. Muthukrishnan, K. Amberiadis and A. Elshabini-Riad -- Influence of floating gate tungsten polycide deposition technique on EEPROM electrical characteristics / K. Ogier-Monnier, P. Boivin and O. Bonnaud -- Isotropic nitride etching for thin nitride barrier self-aligned contact (TNBSAC) in an inductively coupled plasma chemical etcher / J.-H. Kim, J.-O. Ryu and J.-S. Kim [et al.] -- Thermalization process in sputtering systems by atomic absorption spectroscopy / E. Augustyniak, S. V. Filimonov and C. Lu -- Application of backside fiber optic system for in-situ CMP endpoint detection on shallow-trench isolation wafers / D. V. Bakin, D. E. Glen and M. H. Sun -- Real-time spectroscopic reflectometer for end-point detection on multichamber deposition processes / P. Boher, S. Noygues and J. L. Stehle --
• Developments in focused ion beam metrology / J. A. Salen, G. J. Athas and D. Barnes [et al.] -- Technological sensors on slow electromagnetic waves / Yu. N. Pchelnikov and A. A. Yelizarov -- Real-time detection of chamber condition by observing the plasma spectrum intensity / C. W. Cho, Y. K. Hwang and P. T. Chu [et al.] -- HECTOR: transnanometer Z-axis calibration artifacts for semiconductor process control / A. E. Hatheway -- Magnetoresistance of heterophase materials at high pressures / V. V. Shchennikov -- Polyimide defect reduction / S.-S. Chen, H.-C. Chen and C.-C. Kuo -- Novel method to eliminate SOG-etching-back-induced random particle / C. F. Hsu, C. H. Chang and M. K. Yu [et al.] -- Analysis of the generation of the misfit dislocations during the boron prediffusion in silicon / F. Gaiseanu, G. Kissinger and D. Kruger [et al.] --
• SOPRA SE3000: a new tool for high-accuracy characterization of multilayer structures on very small spot size / P. Boher, M. Bucchia and J. P. Rey [et al.] -- Stepper NA/PC optimization DOE for i-line masking / C. Y. Lee, W. W. Ma and A. Cheng [et al.] -- Development of consolidated in-situ metallization processes for enhanced productivity / B. Axan and D. Edmonds -- Resolving localized oxide breakthrough during poly etch of nonvolatile floating gate structures / J. T. Healey, V. Sim and S. E. Rubel.

ISBN

081942966X

LCCN

98233179

OCLC

ocm39931377

Owning Institutions

Columbia University Libraries