Research Catalog
Interconnect and contact metallization for ULSI : proceedings of the international symposium
- Title
- Interconnect and contact metallization for ULSI : proceedings of the international symposium / editors, G.S. Mathad, H.S. Rathore, Y. Arita ; [sponsored by] Dielectric Science and Technology, Electronics, and Electrodeposition Divisions.
- Author
- Symposium on Interconnect and Contact Metallization for ULSI (1999 : Honolulu, Hawaii)
- Publication
- Pennington, N.J. : Electrochemical Society, [2000], ©2000.
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| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TK7874.76 .S97 1999g | Off-site |
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Details
- Additional Authors
- Description
- ix, 340 pages : illustrations; 24 cm.
- Series Statement
- Proceedings ; 99-31
- Uniform Title
- Proceedings (Electrochemical Society) ; v. 99-31.
- Subjects
- Electric conductivity > Congresses
- Electrochemical metallizing > Congresses
- Copper > Congresses
- Plasma-enhanced chemical vapor deposition > Congresses
- Integrated circuits > Ultra large scale integration > Design and construction > Congresses
- Dielectrics > Congresses
- Electric contacts > Congresses
- Integrated circuits > Ultra large scale integration > Materials > Congresses
- Note
- "Papers presented at the Symposium on Interconnects and Contact Metallization for ULSI ... held in Honolulu, HI, October 17-22, 1999, as part of the Joint International Meeting of the Electrochemical Society, Inc., USA and the Electrochemical Society of Japan"--Pref.
- Bibliography (note)
- Includes bibliographical references and index.
- ISBN
- 1566772540
- LCCN
- 00103066
- OCLC
- ocm44929062
- Owning Institutions
- Columbia University Libraries