Research Catalog

Title

Fundamental aspects of electrochemical deposition and dissolution : proceeings of the international symposium : / editors, M. Matlosz [and others].

Author

Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution (1999 : Honolulu, Hawaii)

Publication

Pennington, New Jersey : Electrochemical Society, [2000], ©2000.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Matlosz, M.
• Electrochemical Society. Electrodeposition Division.

Description

x, 438 pages : illustrations; 24 cm.

Series Statement

Proceedings Volume ; v. 99-33

Uniform Title

Proceedings (Electrochemical Society) ; v. 99-33.

Subjects

• Electroplating > Mathematical models > Congresses
• Electroplating > Congresses
• Metals > Dissolution > Congresses
• Metals > Dissolution > Mathematical models > Congresses

Note

• The symposium was held in October, 1999, in Honolulu, Hawai--derived from Preface.

Bibliography (note)

• Includes bibliographical references and indexes.

Contents

1. Electrocrystallization of Metals and Modern Nanotechnology / W. J. Lorenz, W. Wiesbeck and G. Staikov -- 2. Scaling Analysis of Roughness During Silver Electrodeposition / D. G. Foster and J. Jorne -- 3. Cyclical Electrodeposition / Dissolution Processes Studied by Scaling Analysis / D. G. Foster, J. Jorne and Y. Shapir / [et al.] -- 4. The Nucleation and Growth of Electrochemically Deposited Copper on PVD Copper and TiN using Alkaline (EDTA and NH[subscript 3]) Baths / L. Graham, C. Steinbruchel and D. J. Duquette / [et al.] -- 5. Electrodeposition of Zinc-SiO[subscript 2] Composite / K. Kondo, A. Ogishi and Z. Tanaka -- 6. Kinetics of the Electrodeposition of Pb-Sn Alloys at Glassy Carbon and Gold Electrodes / I. Petersson and E. Ahlberg -- 7. Codeposition Behavior and Characteristic of Composite Zinc Electroplating / K. Ishii, M. Kimoto and Y. Yoshikawa / [et al.] -- 8. Electrochemical Characterization of Copper Deposition from Citrate Solutions / W. Meuleman and S. Roy -- 9. Modeling the Effects of 1-Phenyl-5-Mercaptotetrazole on the Electrocrystallization of Silver / D. Gonnissen, W. Simons and A. Hubin -- 10. Effects of Chloride Ion on Copper Deposition into Porous Silicon / J. Sasano, J. Jorne and N. Yoshimi / [et al.] -- 11. Hydrogen Effects in the Electrodeposition of Au, Cu and Au-Cu: an Electrochemical and Structural Study / B. Bozzini, P. L. Cavallotti and G. Giovannelli -- 12. Early Stages of Pattern Evolution in Anodic Porous Oxide Film on Al 6061 / H. Gao, A. Scheeline and A. J. Pearlstein -- 13. Dissolution-Deposition Kinetics of Iron Group Metals: Critical Analysis of Reaction Models / T. R. Agladze -- 14. Structural and Electrokinetic Studies of Iron Group Metals Electrodeposition / P. L. Cavallotti and A. Vicenzo -- 15. Electrocrystallization of Cu / Co Multilayers: in-situ Mass, Internal Stress and Magnetization Measurements / A. Gundel, E. Chassaing and J. E. Schmidt -- 16. Changes in Viscoelasticity of Polyaniline during Electrochemical Deposition in Common Acid Solutions / G.-R. Lee, S.-E. Bae and T.-B. Kim / [et al.] -- 17. Adhesion of Ni-P Coating to Dielectric and Electroless Plating for Piezoengineering / T. N. Khoperia -- 18. Optical Phenomena of Single Silver Clusters / W. Plieth, G. Sandmann and H. Dietz / [et al.] -- 19. Silane layers on Zinc / Zinc Oxide Surfaces / S. Hansal, W. E. G. Hansal and M. A. Polzler / [et al.] -- 20. Corrosion and Dissolution Rates of Some Metals Measures by Simulataneous Corrosion Measurements by Titration (CMT) and Electrochemical Measurements (EC) / G. Bech-Nielsen -- 21. Studies on Zn-Ni-Cd Ternary Alloy Coatings as a Replacement for Cadmium Coatings / A. Durairajan, B. Haran and R. White / [et al.] -- 22. Preparation of Iridium-Oxide Coated Titanium Electrode for Oxygen Evolution and Chlorine Production by Electrolysis / Y. Sato, S. Honda and K. Kobayakawa / [et al.] -- 23. Electrodeposited Ni-Fe-C Cathodes for Hydrogen Evolution / S. Meguro, T. Sasaki and H. Katagiri / [et al.] -- 24. Electrodissolution of p-Si in Acidic Fluoride Media. Modeling of the Steady State / S. Cattarin, I. Frateur and M. Musiani / [et al.] -- 25. Photoelectrochemical Fabrication of Oxide Deposition on Ti Substrate / Y. Matsumoto, M. Noguchi and T. Matsunaga -- 26. Spontaneous Electrochemical Deposition of Metals From Organic Solutions / H. Gu, T. J. O'Keefe and M. J. O'Keefe / [et al.] -- 27. Investigation of the Mechanism and Kinetics of Activation for Electroless Plating and Competitive Submicron and LIGA Technologies / T. N. Khoperia -- 28. Electrodeposition of GMR Ni / Cu Multilayers and Rare Earth - Iron Group Alloy Thin Films in a Recirculating Electrochemical Flow Reactor / N. V. Myung, M. Schwartz and K. Nobe -- 29. Nitinol's Electrochemical Behavior with Application to Photochemical Processing / A. Pikelny and G. R. Hoppe -- 30. The Effect of Process Variables on Electrotinning in a Methanesulfonic Acid Bath / Y.-H. Yau -- 31. Production of High Surface Area Nickel Electrodes by Electroplating Through a Microporous Polymer / I. J. Brown and S. Sotiropoulos -- 32. Electrodeposited Alloys of Ni, Fe, Co, and P for High Aspect Ratio Microstructures / B. Loechel, S. Jung and H. Zimer / [et al.] -- 33. The Effects of Bath Conditions on Electroless Deposition of Nickel for Micro Structures Fabrication / J. Huh and J.-H. Lee -- 34. Monte Carlo Simulations of the Electrodeposition of Copper / T. J. Pricer, M. J. Kushner and R. C. Alkire -- 35. Numerical Simulation of Anodic Reactions / G. E. Giles, L. J. Gray and J. S. Bullock / [et al.] -- 36. A Current Distribution Model of Copper Deposition from Cuprous Cyanide Electrolyte on a Rotating Disk / D. A. Dudek and P. S. Fedkiw -- 37. In Situ Infrared Reflection Study on the Electrodeposition of Polyaniline Catalyzed by the Oxidized Form of Prussian Blue / M. Nakayama, J. Shimomura and K. Nakaoka / [et al.] -- 38. Current Efficiency and the Electromigration Contribution to the Cu Partial Current during the Deposition of Co-Ni-Cu Alloys from Acetate and Sulphamate Multilayer Electrolytes / A. I. Masliy, S. N. Ovchinnikova and A. A. Weiss / [et al.] -- 39. Electroless Deposition of Gold Using Different Reducing Agents / S. S. Djokic -- 40. Initiation Process of Film Formation for Cationic Electropaint System / Y.-I. Suzuki, H. Fukui and K. Tsuchiya / [et al.] -- 41. Simulation of Shape Evolution During Electrodeposition of Copper in the Presence of Additives / D. Veyret, M. Georgiadou and R. L. Sani / [et al.] -- 42. Shape Evolution of Electrodeposited Bumps into Deep Cavities / K. Hayashi, K. Fukui and Z. Tanaka / [et al.] -- 43. Modeling of Uniformity and 300-mm Scale-Up in a Copper Electroplating Tool / L. Gochberg.

ISBN

1566772567

OCLC

• 45413849
• ocm45413849

Owning Institutions

Columbia University Libraries