Research Catalog

2000 HD International Conference on High-Density Interconnect and Systems Packaging : 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA

Title
2000 HD International Conference on High-Density Interconnect and Systems Packaging : 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA / sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media.
Author
HD International Conference on High-Density Interconnect and Systems Packaging (2000 : Denver, Colo.)
Publication
Reston, VA : IMAPS ; [Bellingham, Wash.] : Published in cooperation with SPIE--the International Society for Optical Engineering, [2000], ©2000.

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Holdings

Details

Additional Authors
  • International Microelectronics and Packaging Society.
  • Society of Photo-optical Instrumentation Engineers.
  • CMP Media.
Description
xvi, 617 pages : illustrations; 28 cm.
Series Statement
SPIE proceedings series ; v. 4217
Uniform Title
Proceedings of SPIE--the International Society for Optical Engineering ; v. 4217.
Alternative Title
  • HD International Conference on High-Density Interconnect and Systems Packaging
  • International Conference on High-Density Interconnect and Systems Packaging
  • High-density interconnect and systems packaging
  • High density interconnect and systems packaging
Subjects
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
0930815602
OCLC
  • ocm46338872
  • SCSB-4114688
Owning Institutions
Columbia University Libraries