Research Catalog

Title

Reliability, testing, and characterization of MEMS/MOEMS II : 27-29 January 2003, San Jose, California, USA / Rajeshuni Ramesham, Danelle M. Tanner, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering ; cooperating organizations, SEMI--Semiconductor Equipment and Materials International, SolidState Technology, [and] Sandia National Laboratories (USA).

Publication

Bellingham, Wash., USA : SPIE, [2003], ©2003.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Ramesham, Rajeshuni.
• Tanner, Danelle Mary, 1952-
• Society of Photo-optical Instrumentation Engineers.
• Semiconductor Equipment and Materials International.
• Solid State Technology (Organization)
• Sandia National Laboratories.

Description

xliv, 334 pages : illustrations (some color); 28 cm.

Series Statement

SPIE proceedings series, 0277-786X ; v. 4980

Uniform Title

Proceedings of SPIE--the International Society for Optical Engineering ; v. 4980.

Subject

• Microelectromechanical systems > Reliability > Congresses
• Microelectromechanical systems > Testing > Congresses

Bibliography (note)

• Includes bibliographical references and index.

Contents

• Micropackaging technologies for integrated microsystems: applications to MEMS and MOEMS / K. Najafi -- NEXUS: roadmaps and applications / A. El-Fatatry -- MEMS and MOEMS for National Security applications / M. Scott -- DMD reliability: a MEMS success story / M. R. Douglass -- Reliability evaluation of thermally actuated micromachined relays for space applications / A. Teverovsky and A. K. Sharma -- Wear mechanisms in a reliability methodology / D. M. Tanner and M. T. Dugger -- Long-term drift measurements in MEMS-based mass flow controllers / E. Lawrence and A. K. Henning -- MEMS characterization using laser Doppler vibrometry / E. M. Lawrence, K. E. Speller and D. Yu -- Dynamic MEMS devices for multiaxial fatigue and elastic modulus measurement / C. D. White, R. Xu, X. Sun and K. Komvopoulos -- Template-based software for accurate MEMS characterization / E. Novak, M. B. Krell and T. Browne --
• Anodic oxidation-induced delamination of the SUMMiT poly O to silicon nitride interface / R. A. Plass, J. A. Walraven, D. M. Tanner and F. W. Sexton -- Electrical breakdown and ESD phenomena for devices with nanometer-to-micron gaps / A. J. Wallash and L. Levit -- Failure analysis of a multi-degree-of-freedom spatial microstage / J. A. Walraven and B. Jokiel, Jr. -- A new SEM/FIB crossbeam inspection tool for high-resolution materials and device characterization / P. Gnauck and P. Hoffrogge -- Micro/nanoscale tribology and mechanics of MEMS/NEMS materials and devices / B. Bhushan -- Surface characterization and adhesion analysis for polysilicon surface micromachined flaps / X. Xue and L. M. Phinney -- Degradation of monolayer lubricants for MEMS / M. T. Dugger, R. J. Hohlfelder and D. E. Peebles -- Use of thermal cycling to reduce adhesion of OTS-coated MEMS cantilevers / S. M. Ali and L. M. Phinney --
• Reciprocating silicon microtribometer / P. Dubois, S. von Gunten, A. Enzler, U. Lippuner, A. Dommann and N.-F. de Rooij -- Fatigue of LIGA nickel / B. L. Boyce -- Fracture toughness study on LIGA fabricated microstructures / C. Oropeza, K. Lian and W. Wang -- Temperature effects on microstructural evolution and resulting surface mechanical properties of Ni-based MEMS structures / K. Lian, J. C. Jiang, Z. G. Ling and E. I. Meletis -- Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers / C. Lohmann, A. Bertz, M. Kuchler, D. Reuter and T. Gessner -- Thermal stability of SU-8 fabricated microstructures as a function of photo initiator and exposure doses / K. Lian, Z. G. Ling and C. Liu -- MEMS production and yield improvement using a flux-free/void-free assembly process / G. Pangelina -- Resonant frequency method for monitoring MEMS fabrication / D. M. Tanner, A. C. Owen, Jr. and F. Rodriguez --
• Diffusive transport in supercritical CO[subscript 2] drying of MEMS structures / P. J. Resnick and M. G. Hankins -- Vapor deposition of amino-functionalized self-assembled monolayers on MEMS / M. G. Hankins, P. J. Resnick, P. J. Clews, T. M. Mayer, D. R. Wheeler, D. M. Tanner and R. A. Plass -- MEMS packaging efforts at Sandia National Laboratories / J. S. Custer -- New getter configuration at wafer level for assuring long-term stability of MEMS / M. Moraja, M. Amiotti and R. C. Kullberg -- Utilization of Pb-free solders in MEMS packaging / G. S. Selvaduray -- Investigation of NEG thick film for vacuum packaging of MEMS / Y. F. Jin, Z. P. Wang, L. Zhao, P. C. Lim and J. Wei -- Solder bonding for microelectromechanical systesm (MEMS) applications / A. Goyal, S. Tadigadapa and R. Islam -- Novel hermetic packaging methods for MOEMS / D. Stark -- Dual-function leak detector for MEMS devices / Y. F. Jin, Z. P. Wang, Z. F. Wang, X. Q. Shi, P. C. Lim, M. Miao and X. C. Shan --
• Reliability and qualification of an integrated MEMS attenuator for optical component applications / R. Hickey, H. Fettig, J. Wylde, S. J. Legros, R. E. Mallard, N. Nentwich and C. Hart -- Burn-in test reduction for the digital micromirror device (DMD) / T. J. Hogan, P. Barker and M. R. Douglass -- Characterization of MOEMS devices for the instrumentation of the Next-Generation Space Telescope / F. Zamkotsian, J. Gautier and P. Lanzoni.

ISBN

0819447803

OCLC

• ocm51894691
• SCSB-4345419

Owning Institutions

Columbia University Libraries