Research Catalog

Proceedings : IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado / sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff].

Title: Proceedings : IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado / sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff].
Author: IMAPS Conference and Exhibition on Ceramic Interconnect Technology (2003 : Denver, Colo.) http://id.loc.gov/authorities/names/no2003090696
Publication: Bellingham, Wash., USA : SPIE, [2003], ©2003.

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Description

254 pages : illustrations; 28 cm.

Series Statement

SPIE proceedings series, 0277-786X ; v. 5231

Uniform Title

Proceedings of SPIE--the International Society for Optical Engineering ; v. 5231.

Alternative Title

2003 Ceramic Interconnect Technology Conference
Ceramic Interconnect Technology Conference
Ceramic interconnect technology : the next generation
IMAPS Conference and Exhibition on Ceramic Interconnect Technology

Subjects

Bibliography (note)

Includes bibliographical references and index.

Contents

Dual Mode Switch Duplexer Modules Packaged in LTCC with 3D FEM / Toshio Nishikawa -- Development of Miniature Bluetooth Module for Manufacturability using a System-in-Package Approach / Andrew Cervin-Lawry, Kamal Ali, Tom Bernacki, Sukhi Binapal, Cristian Miortescu, Atin Patel, Paul Woo and Lisa Woodward -- Design Considerations for Hybrid LTCC-RF-Filters / Jens Muller -- LTCC Based Slow Wave Filters for Wireless and Handheld Products / F. Magableh, V. Wang, A. Elshabini and F. Barlow -- Interconnection Reliability Studies of Some Ceramic Components and the Introduction of the Results into MTBF Calculations / Olli Salmela, Klas Andersson, Jussi Sarkka and Markku Tammenmaa -- Thermomechanical Responses and Reliability of LTCC Solder Attachments for Wireless Applications / Chia-Yu Fu and Peter Vo -- Side-Fill Underfill for RF SAW Packaging / Michael Chang, Brian Lu, Ken Wu and Tarou Fukui -- Overmolded LTCC RF Modules / Jicheng "Jeff" Yang, Robert Darveaux, Adrian Federigan, Tony Arellano, Seok Bong Kim and Jin Young Khim -- Ultra Wide Frequency Band Ceramic Package and Assembly Technology / Y. Tsukiyama, M. Shiobara, M. Hashimoto and A. Osakada -- Broadband Electrical Design and Modeling of Packages Integrated in LTCC-Substrate / M. Nisznansky, Ch. Ziegler, L.-P. Schmidt, R. Hocke and O. Wohlgemuth -- Telecom MEMS Packaging in Ceramics / David A. Ramsey, Nagesh R. Basavanhally and Yee L. Low -- Screen Printed Feature Size Capabilities / Daniel C. Hughes and Steve E. Ernster -- A High Density Flip-Chip Interconnect Technology on Multilayer Ceramic Substrates for Automotive Controller Applications / C. W. Berlin, D. H. R. Sarma, W. A. Sozansky and D. W. Zimmerman -- Continued Study in Power Module Substrates for Automotive Harsh Environments / Keith Easler -- Packaging and Interconnect for RF and Microwave / Paul Collander and George Passiopoulos -- Design and Manufacturing of Integrated Modules for Wireless and RF Applications using Multi-Mix Microtechnology and Green Tape LTCC Materials / James J. Logothetis, Daniel I. Amey and Timothy P. Mobley -- LTCC Technology for High Performance Low Power Base Station Applications / George Passiopoulos -- Ceramic Triple-Mode Delay Filter for Cellular Base Station Applications / Weili Wang, William Wilber, William Engst and Ricardo Espina -- The Measurement and Practical Significance of Complex Permittivity at mm-wave Frequencies / Charles Free and Zhengrong Tian -- Broadband Permittivity and Loss Tangent Measurements using a Split-Cylinder Resonator / Michael D. Janezic, James Baker-Jarvis and Edward F. Kuester -- Four-Port On-Wafer Measurements of Coupled Transmission Lines on LTCC / Ch. Ziegler, M. Nisznansky, L.-P. Schmidt, R. Hocke and O. Wohlgemuth -- Using Defect Information to Manage LTCC Yield and Manufacturing Costs / Benjamin Arnold -- Factors Affecting Characteristics of Thick Film Voltage Tunable Dielectric Materials / Xiaohong Tang, Marion Ed. Ellis, Frederick Duvall, Barry Treadway, Elijah Underbill and Luna Chiu -- Dielectric Material and Waveguide Development for Low Temperature Co-fired Ceramics / Michael T. Lanagan, Chiping Wang, Sayed-Khaled Rajab, Clive Randall, Hyo-Tae Kim, Hsin-Cheng Chen and Kuen-Fwu Fuh -- Constrained-Sintered Material Systems for Interconnects and Packages / Christopher R. Needes, Carl B. Wang, Kenneth W. Hang, Michael F. Barker, Daniel I. Amey, Michael A. Smith and Kenneth E. Souders -- Development of Integrated High Value Resistors on Novel Substrates / Bruce A. Tuttle, David P. Williams, Walter R. Olson, Paul G. Clem, Bruce King and Michael Renn -- Compact Stacked Tandem Coupler in LTCC / Michael J. Lee and John W. Gipprich -- Design of Compact Multi-Level Via-Less Bandpass Filters with Higher Harmonic Suppression / Kala Gururajan and Raghu K. Settaluri -- Miniaturized High Performance Low-pass and Bandstop Filters for Wireless Applications / Harish Peddibhotla and Raghu K. Settaluri -- Design of Mimaturised RF Filters in LTCC / Sarmad Al-Taci and George Passiopoulos -- Characterization and Control of Low Temperature Co-Fire Ceramic (LTCC) Sintering / C. B. DiAntonio, D. N. Bencoe and K. G. Ewsuk -- Trends in LTCC Processing / Dean Anderson -- The Co-sintering of LTCC Materials / Terry J. Carino -- A Model System for Interfacial Reactions in LTCC Materials / Lawrence P. Cook, Winnie Wong-Ng, Peter Schenck, Mark Vaudin and Julia Suh -- Manufacturability and Reliability of Trimmed Buried Resistors in LTCC / Waleed Ehrhardt, Heiko Thust and Jens Muller -- Dielectric and Magnetic Materials for Integrated Passives / A. H. Feingold, M. Heinz and R. L. Wahlers -- High k LTCC System for High Frequency Applications / Yong S. Cho, Kenneth W. Hang, Carl B. Wang, Kenneth E. Souders, Diptarka Majumdar, Daniel Amey and Christopher R. Needes -- Performance of Low-Ohmic Co-Fired Buried Resistors in A6S Tape / Michail Moroz -- Embedded Heat Exchanger in LTCC Substrate / Hari Adluru, Marc A. Zampino, Yanqiug Liu and W. Kinzy Jones -- LTCC Based MEMS Impingement Coolers / K. Saxena, G. Wang, S. Ang, A. Elshabini and F. Barlow -- Microfluidics for Thermal Management: Applications, Fabrication, and Demonstration in LTCC / Brian Smith, Michael Pleskach and Carol Gamlen -- Novel Structures in Ceramic Interconnect Technology / Ken Peterson, Steven Rohde, Tim Turner, Robert Stokes and Adrian Casias -- Ceramic Packaging for MEMS-Based Microsystems / Jonathan S. Custer -- Joining Small Components with Reactive Multilayer Foils / T. P. Weihs and O. M. Knio -- Ion Mobility Spectrometer Fabricated in LTCC / D. G. Plumlee, J. Hartman, A. J. Moll, M. Tam, P. Dwivedi and H. H. Hill, Jr. -- Polymer-Derived Ceramic MEMS: Science and Technology / L. A. Liew and R. Raj -- Microdischarge Arrays in Ceramics and Semiconductors Multilayer Structures: Photonic Devices for Emission and Detection / J. G. Eden.

ISBN

0930815688 (IMAPS)
0819451053 (SPIE)

Owning Institutions

Columbia University Libraries