Research Catalog

Title

Materials, technology and reliability for advanced interconnects and low-k dielectrics--2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A / editors: Andrew J. McKerroe ... [et al.].

Publication

Warrendale, Pa. : Materials Research Society, c2003.

Items in the Library & Off-site

Details

Additional Authors

• McKerrow, Andrew J.
• Materials Research Society. Meeting (2003 : San Francisco, Calif.)
• Symposium on Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (2003 : San Francisco, Calif.)

Description

xv, 515 p. : ill.; 24 cm.

Series Statement

Materials Research Society symposium proceedings ; v. 766

Uniform Title

Materials Research Society symposia proceedings ; v. 766.

Subjects

• Integrated circuits > Reliability > Congresses
• Semiconductors > Congresses
• Integrated circuits > Materials > Congresses
• Dielectric films > Congresses
• Semiconductors > Junctions > Congresses

Note

• "Symposium E, 'Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics,' was held April 23-25 at the 2003 MRS Spring Meeting in San Francisco, California."--p. xv.

Bibliography (note)

• Includes bibliographic references and indexes.

Contents

• The Characterization and Preparation of Porous Low Dielectric Films Using Various Cyclodextrins as Template Materials / Jin-Heong Yim, Jung-Bae Kim, Hyun-Dam Jeong, Yi-Yeoul Lyu, Sang Kook Mah, Jingyu Hyeon-Lee, Kwang Hee Lee, Seok Chang, Lyong Sun Pu, Y. F. Hu, J. N. Sun and D. W. Gidley -- Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor Deposition / M. L. O'Neill, R. N. Vrtis, J. L. Vincent, A. S. Lukas, E. J. Karwacki, B. K. Peterson and M. D. Bitner -- Electrical, Mechanical, and Structural Properties of Fluoro-Containing Poly(silsesquioxanes) Based Porous Low-k Thin Films / Jingyu Hyeon-Lee, Jihoon Rhee, Jungbae Kim, Jin-Heong Yim and Seok Chang -- Plasma Hydrogenation - A New Method of Reducing the k Value of the Low-k Polyimide Film / Yue Kuo, Taewoo Chung and Helinda Nominanda -- Expanding Thermal Plasma for Low-k Dielectrics Deposition / M. Creatore, Y. Barrell, W. M. M. Kessels and M. C. M. van de Sanden -- Stress Stability of PECVD Silicon Nitride Films During Device Fabrication / Michael P. Hughey and Robert F. Cook -- Characterization of Boron Carbo-Nitride Films Deposited by Low Temperature Chemical Vapor Deposition / E. R. Engbrecht, C. J. Cilino, K. H. Junker, Y.-M. Sun, J. M. White and J. G. Ekerdt -- MIM Capacitors With HfO[subscript 2] and HfAlO[subscript x] for Si RF and Analog Applications / Xiongfei Yu, Chunxiang Zhu, Hang Hu, Albert Chin, M. F. Li, B. J. Cho, Dim-Lee Kwong, P. D. Foo and M. B. Yu -- Material and Electrical Characterization of HfO[subscript 2] Films for MIM Capacitors Application / Hang Hu, Chunxiang Zhu, Y. F. Lu, Y. H. Wu, T. Liew, M. F. Li, B. J. Cho, W. K. Choi and N. Yakovlev -- Observation of Grain Growth in Cu Films by In Situ EBSD Analysis / D. P. Field, M. M. Nowell and O. V. Kononenko -- Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects / G. Steinlesberger, M. Engelhardt, G. Schindler, W. Steinhogl, M. Traving, W. Honlein and E. Bertagnolli -- AFM Studies of Deformation and Interfacial Sliding in Interconnect Structures in Microelectronic Devices / C. Park, I. Dutta, K. A. Peterson and J. Vella -- Effect of Barrier Layers on the Texture and Microstructure of Copper Films / Tejodher Muppidi, David P. Field and John E. Sanchez -- Grain Boundary Characteristics and Stress-Induced Damage Morphologies in Sputtered and Electroplated Copper Films / Hyun Park, Soo-Jung Hwang, Kyu Hwan Oh and Young-Chang Joo -- High-Frequency Heterodyne Force Microscopy Investigations of Copper Interconnects / Yuegui Zheng and Robert Geer -- A Novel Technique to Re-Construct 3D Void in Passivated Metal Interconnects / Cher Ming Tan, Zhenghao Gan, Guan Zhang, Krishnamachar Prasad and Dao Hua Zhang -- Characterization of Electroplated Copper Films With Laser-Generated Surface Acoustic Waves / A. A. Maznev, M. Gostein and S. H. Brongersma -- Detection of Voids in Tungsten Interconnects Vias Using Laser-Induced Surface Acoustic Waves / Joshua Tower, Michael Gostein, Koichi Otsubo and Atsushi Kawasaki -- Copper Oxidation Studied by In Situ Raman Spectroscopy / Robert Schennach and Andreas Gupper -- The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum-Based Thin Films for Copper Diffusion Barrier Applications / Degang Cheng and Eric T. Eisenbraun -- Characterization of CVD Ti[subscript x]C[subscript y]N[subscript z] Films Deposited as Diffusion Barriers for Cu on Low-k Dielectrics Methylsilsequiazane / W. C. Gau, P. T. Liu, T. C. Chang and L. J. Chen -- Characterization of Atomic Layer Deposited WN[subscript x]C[subscript y] Thin Film as a Diffusion Barrier for Copper Metallization / Soo-Hyun Kim, Su Suk Oh, Hyun-Mi Kim, Dae-Hwan Kang, Ki-Bum Kim, Wei-Min Li, Suvi Haukka and Marko Tuominen -- Enhancement of Copper Wetting via Surfactant-Based Post-Treatment of Ultra-Thin Atomic Layer Deposited Tantalum Nitride Liners / Oscar van der Straten, Yu Zhu, Kathleen Dunn and Alain Kaloyeros -- Vapor Treatment of Copper Surface Using Organic Acids / Kenji Ishikawa, Teruo Yagishita and Moritaka Nakamura -- Anisotropic Plasma a Chemical Vapor Deposition of Copper Films in Trenches / Kosuke Takenaka, Masao Onishi, Manabu Takenshita, Toshio Kinoshita, Kazunori Koga, Masaharu Shiratani and Yukio Watanabe -- Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVD W[subscript 2]N Barrier Layer / Degang Cheng, Guillermo Nuesca and Eric Eisenbraun -- The Correlation of Adhesion Strength With Barrier Structure in Cu Metallization / A. Sekiguchi, J. Koike, K. Ueoka, J. Ye, H. Okamura, N. Otsuka, S. Ogawa and K. Maruyama -- The Formation of Low Temperature Cu[subscript 3]Si in Ag(Cu)/Si Structure Upon Annealing and Its Effects on Adhesion and Resistivity / Sungjin Hong, Seob Lee, Yeonkyu Ko and Jaegab Lee -- Deposition and Characteristics of Tantalum Nitride Films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion Barrier / Kyoung-Il Na, Se-Jong Park, Woo-Cheol Jeong, Se-Hoon Kim, Sung-Eun Boo, Nam-Jin Bae and Jung-Hee Lee -- Enhanced Adhesion of Cu Film on a Low-k Material by Using Ti Glue Layer, B Dopant and N[subscript 2] Plasma Treatment / Y. K. Ko, S. Lee, H. J. Yang, C. Shim, D. Jung and J. G. Lee -- Reduced Time for Uniform Etching of Cu Power Planes During FIB Editing / V. V. Makarov, W. B. Thompson and T. R. Lundquist.
• Materials Research Society Symposium Proceedings -- 3D System Integration Technologies / Peter Ramm, Armin Klumpp, Reinhard Merkel, Josef Weber, Robert Wieland, Andreas Ostamann and Jurgen Wolf -- Air Bridge Technology: A Comparison of Novel Interconnect Materials and Integration Schemes for beyond 45 nm / Kenneth Foster, Joost Waeterloos, Don Frye, Steve Froelicher and Mike Mills -- Wafer Thinning for Monolithic 3D Integration / A. Jindal, J.-Q. Lu, Y. Kwon, G. Rajagopalan, J. J. McMahon, A. Y. Zeng, H. K. Flesher, T. S. Cale and R. J. Gutmann -- Dielectric Glue Water Bonding for 3D ICs / Y. Kwon, A. Jindal, J. J. McMahon, J.-Q. Lu, R. J. Gutmann and T. S. Cale -- AlCu Pattern Generation on 3D Structured Wafer Using Multi Level Exposure Method on Electrodeposited Polymer Material / Vineet Sharma, Arief B. Suriadi, Frank Berauer and Laurie S. Mittelstadt -- Sequential Process Modeling for Determining Process-Induced Thermal Stress in Advanced Cu/Low-k Interconnects / Kwanho Yang, Joost J. Waeterloos, Jang-Hi Im and Michael E. Mills -- Some Aspects of the Materials Science of Low-k Integration / Vincent McGahay -- Silicides for the 65 nm Technology Node / Paul R. Besser, Simon Chan, Eric Paton, Thorsten Kammler, David Brown, Paul King and Laura Pressley -- Dual Damascene Process for Fat Wires in Copper/FSG Technology / J. Gambino, T. Stamper, H. Trombley, S. Luce, F. Allen, C. Weinstein, B. Reuter, M. Dunbar, V. Samek, P. McLaughlin and T. Kane -- Adhesion Enhancement for Multiple Level Cu/SiLK Integration / X. T. Chen, D. Lu, Y. T. Tan, Y. W. Chen and P. D. Foo -- Assessment of Reliability of Cap Layers Used in Cu-Black Diamond Interconnects / Ahila Krishnamoorthy, N. Y. Huang and Shu-Yunn Chong -- A Study of Atomic Layer Deposition and Reactive Plasma Compatibility With Mesoporous Organosilicate Glass Films / E. Todd Ryan, Melissa Freeman, Lynne Svedberg, J. J. Lee, Todd Guenther, Jim Connor, Katie Yu, Jianing Sun and David W. Gidley -- Impact of Low-k Dielectrics on Electromigration Reliability for Cu Interconnects / Paul S. Ho, Ki-Don Lee, Ennis T. Ogawa, Sean Yoon and Xia Lu -- Quantitative Characterization of Dislocation Structure Coupled With Electromigration in a Passivated Al (0.5wt% Cu) Interconnects / R. I. Barabash, N. Tamura, B. C. Valek, R. Spolenak, J. C. Bravman, G. E. Ice and J. R. Patel -- Properties and Barrier Material Interactions of Electroless Copper Used for Seed Enhancement / C. Witt and K. Pfeifer -- Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees / C. L. Gan, C. V. Thompson, K. L. Pey, W. K. Choi, C. W. Chang and Q. Guo -- Electromigration Study of Cu Dual-Damascene Interconnects with a CVD MSQ Low-k Dielectric / Xia Lu, Ki-Don Lee, Sean Yoon, Hideki Matsuhashi, Michael Lu, Kai Zhang and Paul S. Ho -- Electromigration of Lower and Upper Cu Lines in Dual-Damascene Cu Interconnects / Ahila Krishnamoorthy, Guo Qiang, Anand V. Vairagar and Subodh Mhaisalkar -- Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects / G. Zhang, C. M. Tan, Z. H. Gan, K. Prasad and D. H. Zhang -- Near-Threshold Electromigration of Damascene Copper on TiN Barrier / William K. Meyer, Raj Solanki and David Evans -- Interfacial Relationships in Microelectronic Devices / Michael Lane and Robert Rosenberg -- Indentation Fracture Toughness Measurements of Low Dielectric Constant Materials / Dylan J. Morris and Robert F. Cook -- Environmental Effects on Subcritical Delamination of Dielectric and Metal Films From Organosilicate Glass (OSG) Thin Films / Y. Lin, J. J. Vlassak, T. Y. Tsui and A. J. McKerrow -- Using Multi-Dimensional Contact Mechanics Experiments to Measure Poisson's Ratio of Porous Low-k Films / B. N. Lucas, J. C. Hay and W. C. Oliver -- Quantitative Measurements of Subcritical Debonding of Cu Films From Glass Substrates / M. Pang and S. P. Baker -- Advanced Characterization of Ultra-Low-k Periodic Porous Silica Films - Pore Size Distribution, Pore-Diameter Anisotropy, and Size and Macroscopic Isotropy of Domain Structure / N. Hata, C. Negoro, S. Takada, K. Yamada, Y. Oku and T. Kikkawa -- Characterization of Nanoporous Low-k Thin Films by Contrast Match SANs / Ronald C. Hedden, Barry J. Bauer and Hae-Jeong Lee -- Determination of Pore Size Distributions in Nano-Porous Thin Films From Small Angle Scattering / Barry J. Bauer, Ronald C. Hedden, Hae-Jeong Lee, Christopher L. Soles and Da-Wei Liu -- Development and Application of On-Wafer Small Angle X-ray Scattering for the Quantification of Pore Morphology in Low-k Porous SiLk Semiconductor Dielectrics / Brian Landes, Brandon Kern, Ted Stokich, Jason Niu, Dorie Yontz, Mike Radler, Carol Mohler, Kacee Ouellette, Sebring Lucero, Jerry Hahnfeld, Danny King, John Quintana and Steve Weigand -- Evaluation of Copper Ion Drift in Low-Dielectric-Constant Interlayer Films by Transient Capacitance Spectroscopy / Takenobu Yoshino, Nobuhiro Hata and Takamaro Kikkawa -- Spectrum of Defect States in Porous Organic Low-k Dielectric Films, Annealed in Argon and Nitrogen / V. Ligatchev, T. K. S. Wong, T. K. Goh. Rusli and Suzhu Yu -- Solvent Diffusion in Porous Low-k Dielectric Films / Denis Shamiryan and Karen Maex -- The Study of Modified Layers in SiCOH Dielectrics Using Spectroscopic Ellipsometry / Marcus A. Worsley, Stacey F. Bent, Stephen M. Gates, Kaushik Kumar, Timothy Dalton and Jeffrey C. Hedrick -- Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric Films / Do Y. Yoon, Hyun Wook Ro, Eun Su Park, Jin-Kyu Lee, Hie-Joon Kim, Kookheon Char, Hee-Woo Rhee, Dongil Kwon and David W. Gidley -- Organofluorosilicate Glass (OFSG): A Dense Low-k Dielectric With Superior Materials Properties / M. L. O'Neill, Y. L. Cheng, A. S. Lukas, Y. L. Wang, E. J. Karwacki, M. S. Feng, R. N. Vrtis, J. L. Vincent, B. K. Peterson and M. D. Bitner -- Plasma Enhanced Chemical Vapor Deposition of Porous Organosilicate Glass ILD Films With k[is equal to or less than]2.4 / Raymond N. Vrtis, Mark L. O'Neill, Jean L. Vincent, Aaron S. Lukas, Brian K. Peterson, Mark D. Bitner and Eugene J. Karwacki -- Development of Porous SiLK Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes / R. J. Strittmatter, J. L. Hahnfeld, H. C. Silvis, T. M. Stokich, J. D. Perry, K. B. Ouellette, Q. J. Niu, J. P. Godschalx, T. H. Kalantar, E. Mubarekyan, R. E. Hefner, Jr., J. W. Lyons, J. M. Dominowski and G. R. Buske -- Mechanical Properties of Organosilicon Thin Films Deposited From Cyclic and Acyclic Precursors Using Water as an Oxidant / Daniel D. Burkey and Karen K. Gleason -- Accelerated Oxidation of Hydrogen Silsesquioxane Thin Films Facilitated by an Organosilicone Resin Additive / Brian R. Harkness, Ron Boisvert, Qian Deng, Ben Zhong, Jianing Sun and David Gidley -- New Nano-Porous Composite Films of Silsesquioxane Polymer and Silicalite-1 for Low Dielectric Applications / Ruo Qing Su, Gabriela Zadrozna, Thomas E. Muller and Johannes A. Lercher -- Creating Nanoporosity by Selective Extraction of Porogens Using Supercritical Carbon Dioxide/Cosolvent Processes / B. Lahlouh, T. Rajagopalan, J. A. Lubguban, N. Biswas, S. Gangopadhyay, J. Sun, D. Huang, S. L. Simon, H. C. Kim, W. Volksen and R. D. Miller -- Supercritical Carbon Dioxide-Based Fluids Used as a Recovery Tool for Low-k Materials / Rosa A. Orozco-Teran, Brian P. Gorman, Zhengping Zhang, Dennis W. Mueller and Richard F. Reidy -- Effects of Supercritical CO[subscript 2] Drying and Photoresist Strip on Low-k Films / R. F. Reidy, Zhengping Zhang, R. A. Orozco-Teran, B. P. Gorman and D. W. Mueller -- Nanoporous Silica Films Derived From Structural Controllable Poly(silsesquioxane) Oligomers by Templating / Wei-Chih Liu, Yang-Yen Yu and Wen-Chang Chen --

ISBN

1558997032

OCLC

• ocm53783095
• SCSB-4847394

Owning Institutions

Columbia University Libraries