Research Catalog

Title

Thin films--stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A. / editors, Sean G. Corcoran [and others].

Publication

Warrendale, Pa. : Materials Research Society, [2004], ©2004.

Items in the Library & Off-site

Details

Additional Authors

• Corcoran, Sean G.
• Materials Research Society. Fall Meeting (2003 : Boston, Mass.)
• Materials Research Society. http://id.loc.gov/authorities/names/n79060208
• Symposium on Thin Films--Stresses and Mechanical Properties (10th : 2003 : Boston, Mass.)

Description

xvii, 583 pages : illustrations; 24 cm.

Series Statement

Materials Research Society symposium proceedings ; v. 795

Uniform Title

Materials Research Society symposia proceedings ; v. 795.

Subject

• Thin films > Mechanical properties > Congresses

Note

• "This proceedings volume contains written versions of the contributions to Symposium U, 'Thin Films--Stresses and Mechanical Properties X,' held December 1-5 at the 2003 MRS Fall Meeting in Boston, Massachusetts."--p. xvii.

Bibliography (note)

• Includes bibliographical references and indexes.

Contents

• Effects of thickness and indenter geometry in nanoindentation of nickel thin films / Padma Parakala, Reza A. Mirshams, Seifollah Nasrazadani and Kun Lian -- Determination of mechanical parameters for rotating MEMS structures as a function of deposition method / S. Soare, S. J. Bull, A. Oila, A. G. O'Neill, N. Wright, A. Horsfall and J. dos Santos -- Direct observations of grain boundary phenomena during indentation of Al and Al-Mg thin films / W. A. Soer, J. Th. M. De Hosson, A. M. Minor, E. A. Stach and J. W. Morris, Jr. -- Experimental measurements of surface residual stress caused by nano-scale contact of rough surfaces / J. Wang, P. Shrotriya, H. H. Yu and K.-S. Kim -- Mechanical properties and morphology of polycrystalline 3C-SiC films deposited on Si and SiO[subscript 2] by LPCVD / Xiao-an Fu, Jeremy Dunning, Srihari Rajgopal and Ming Zhang -- Thermo-mechanical behavior of Fe thin films / Nail R. Chamsoutdinov, Amarante J. Bottger, Rob Delhez and Frans D. Tichelaar -- Thermomechanical behavior of tantalum thin films : the effects of oxygen and the [beta]-[alpha] phase transformation / Robert Knepper, Blake Stevens and Shefford P. Baker -- Temperature dependence of biaxial modulus and thermal expansion coefficient of thin films using wafer curvature method / M. Capanu, A. Cervin-Lawry, A. Patel, I. Koutsaroff, P. Woo, Lynda Wu, J. Oh, J. Obeng and B. McClelland -- Measurement of thin-film stress, stiffness, and strength using an enhanced membrane pressure-bulge technique / Aaron J. Chalekian, Roxann L. Engelstad and Edward G. Lovell -- Thermal-mechanical evaluation of plated electro-magnetic NiFe for MEMS generators / Yibin Xue, Keithan Hillman and David Veazie -- The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure / Yong Xiang, Joost J. Vlassak, Maria T. Perez-Prado, Ting Y. Tsui and Andrew J. McKerrow -- Monotonic testing and tension-tension fatigue testing of free-standing Al microtensile beams / Nicholas Barbosa III, Paul El-Deiry and Richard P. Vinci -- Effect of monazite coating on tensile properties of nextel 720 fibers, tows and minicomposites / Devdas M. Pai, Sergey Yarmolenko, Jagannathan Sankar, Balasubramanian Kailasshankar, Christopher Murphy, Edwardo Freeman and Larry P. Zawada -- Bulge test on free standing gold thin films / Yawen Li and Michael J. Cima -- Microstructure-mechanical properties relationship of laser interference irradiated Ni/Al multi-film / C. Daniel, A. Lasagni and F. Mucklich -- Early yielding and stress recovery in (111) and (100) texture components in Cu thin films determined using synchrotron X-ray diffraction / D. E. Nowak and S. P. Baker -- Indentation and finite element modeling investigations of the indentation size effect in aluminium coatings on borosilicate glass substrates / I. Spary, N. M. Jennett and A. J. Bushby -- Young's modulus, poisson's ratio, and nanoscale deformation fields of MEMS materials / I. Chasiotis, S. W. Cho, T. A. Friedmann and J. P. Sullivan -- Hinge sensitivity in a micro-rotating structure for predicting induced thermo mechanical stress in integrated circuit metal interconnects / J. M. M. dos Santos, K. Wang, S. M. Soare, S. J. Bull, A. B. Horsfall, N. G. Wright, A. G. O'Neill, J. G. Terry, A. J. Walton, A. M. Gundlach and J. T. M. Stevenson -- Modeling and optimal design of multilayer cantilever microactuators / L. H. Han and T. J. Lu -- Evaluation on stress and optical property of thin films used in optical MEMS device / Lianchao Sun and Ping Hou -- Internal oxidation and mechanical properties of Pt-IrO[subscript 2] thin films / Richard R. Chromik, Thirumalesh Bannuru and Richard P. Vinci -- Scratch test measurements on CrN[subscript x] coatings / R. Hoy, P. van Essen, J.-D. Kamminga, G. C. A. M. Janssen and A. P. Ehiasarian -- Tuning the mechanical properties of SiO[subscript 2] thin film for MEMS application / Wang-Shen Su, Weileun Fang and Ming-Shih Tsai -- Optimization of film stresses utilized in composite piezoelectric membrane microgenerators / M. S. Kennedy, M. Zosel, C. D. Richards, R. F. Richards, D. F. Bahr, K. W. Hipps and N. R. Moody -- Stress and strength of free-standing 2-dimensional tetrahedral amorphous carbon bridge arrays / Daniel H. C. Chua, T. H. Tsai, W. I. Milne, D. Sheeja and B. K. Tay -- Residual stress in silicon nitride thin films deposited by ECR-PECVD / E. Cianci and V. Foglietti -- A study on selective etching of SiGe layers in SiGe/Si systems for device applications / Takashi Yamazaki, Tomohide Sekikawa, Shinya Morita, Yoshitaka Hakamada, Hiroyuki Ohri, Shun-ichiro Ohmi and Tetsushi Sakai -- Thin film material parameters derived from full field nanometric displacement measurements in non-uniform MEMS geometries / Jaime F. Cardenas-Garcia, Sungwoo Cho and Ioannis Chasiotis -- Characterizing thin-film stress fields by resonance of membrane arrays / R. Engelstad, E. Lovell, A. Chalekian, S. Janowski, M. Cash and H. Eguchi -- Stress-field in sputtered Mo thin films and Mo/Ni superlattices : origin and evolution after ion-irradiation / A. Debelle, G. Abadias, A. Michel, C. Jaouen, Ph. Guerin and M. Drouet -- Asymmetry in multilayer adhesion : the zinc oxide/silver interface / E. Barthel, P. Nael, O. Kerjan and N. Nadaud -- Design maps for the tensile yield strength of nanoscale metallic multilayers / Adrienne V. Lamm and Peter M. Anderson -- DLC/hydroxyapatite nanocomposites / Roger J. Narayan -- Investigation of structural and mechanical properties of UV and microwave-irradiated Al[subscript 2]O[subscript 3]/ZrO[subscript 2] multilayers by sol-gel coating / A. R. Phani and H. Haefke -- Microstructure and current transport properties of YBa[subscript 2]Cu[subscript 3]O[subscript 7-x]/(Ba[subscript 0.05], Sr[subscript 0.95])TiO[subscript 3] multiple-layer thin films / Y. Luo, R. A. Hughes, J. S. Preston and G. A. Botton.
• Materials Research Society symposium proceedings -- Mechanical strain evolution in Cu/low K interconnect lines / Paul R. Besser and Qing-Ting Jiang -- Irreversible tensile stress development of PECVD silicon nitride films / Michael P. Hughey and Robert L. Cook -- X-ray microbeam diffraction measurements in polycrystalline aluminum and copper thin films / I. F. Moyer, G. S. Cargill III, W. Yang, B. C. Larson and G. E. Ice -- Use of the curvature method to determine the misfit stress of epitaxial semiconducting systems : the case of samples thinned for TEM observation / A. Ponchet, M. Cabic, L. Durand, M. Rivoal and A. Rocher -- Dislocation image stresses at free surfaces by the finite element method / Meijie Tang, Guanshui Xu, Wei Cai and Vasily Bulatov -- Phase field modeling of surface instabilities induced by stresses / D. J. Seol, S. Y. Hu, Z. K. Liu, S. G. Kim, W. T. Kim, K. H. Oh and L. Q. Chen -- An atomistic view of interface-mediated dislocation plasticity in thin metal films / E. S. Ege and Y.-L. Shen -- Dislocation dynamics in semiconductor thin film-substrate systems / E. H. Tan and L. Z. Sun -- Fracture in thin oxide films / D. F. Bahr, A. L. Olson, K. R. Morasch, M. S. Kennedy, D. Rodriguez Marck and A. Alamr -- Measurement of residual stress in ZnO thin films deposited on silicon wafers by the indentation fracture test / Tong-Yi Zhang and Bin Huang -- Thin film herringbone buckling patterns / Xi Chen and John W. Hutchinson -- The effect of oxygen on adhesion of thin copper films to silicon nitride / Mengzhi Pang, Monika Backhaus-Ricoult and Shefford P. Baker -- Fracture patterns in thin films and multilayers / Alex A. Volinsky, Dirk C. Meyer, Tilmann Leisegang and Peter Paufler -- The thermal annealing effect on the residual stress and interface adhesion in the compressive stressed DLC film / Heon Woong Choi, Myoung-Woon Moon, Tae-Young Kim, Kwang-Ryeol Lee and Kyu Hwan Oh -- Subcritical delamination of dielectric and metal films from low-k organosilicate glass (OSG) thin films in buffered pH solutions / Y. Lin, J. J. Vlassak, T. Y. Tsui and A. J. McKerrow -- Bonding characterization of oxidized PDMS thin films / J. J. McMahon, Y. Kwon, J.-Q. Lu, T. S. Cale and R. J. Gutmann -- Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(Pet) substrate prepared by ECRMOCVD coupled with a periodic DC bias / Jin Hyun, Bup Ju Jeon, Dongjin Byun and Joong Kee Lee -- Adhesion strength of polymer coatings studied by laser induced delamination / A. Fedorov, A. van Veen, R. van Tijum and J. Th. M. de Hosson -- Toughness and contact behavior of conventional and low-k dielectric thin films / Robert F. Cook, Dylan J. Morris and Jeremy Thurn -- Understanding adhesion failure in low-k dielectric stack during chemical-mechanical polishing / F. Iacopi, D. Degryse, I. Vos, M. Patz and K. Maex -- Solutions and discussions of thin film undergoing the nonlinear peeling / Yueguang Wei, Siqi Shu and Ying Du -- Effects of varying mean stress and stress amplitude on the fatigue of polysilicon / H. Kahn, R. Ballarini and A. H. Heuer -- Fracture behavior of micro-sized specimens prepared from a TiAl thin foil / K. Takashima, T. P. Halford, D. Rudinal, Y. Higo and P. Bowen -- A membrane deflection fracture experiment to investigate fracture toughness of freestanding MEMS materials / H. D. Espinosa and B. Peng -- Microstructural aspects of fracture in nanolayered TiAlCrN thin films / A. E. Santana, A. Karimi, V. H. Derflinger and A. Schutze -- Resistance to cracking of a stretchable semiconductor : speed of crack propagation for varying energy release rate / Sheng Liu, Hee C. Lim, Min Qu, John F. Federici, Gordon A. Thomas, Helena Gleskova and Sigurd Wagner -- Effect of dielectric materials on stress-induced damage modes in damascene Cu lines / Jong-Min Paik, Hyun Park, Ki-Chul Park and Young-Chang Joo -- Young's modulus variation with thickness of thin films / L. G. Zhou and Hanchen Huang -- Stretchable conductors : thin gold films on silicone elastomer / Stephanie P. Lacour, Sigurd Wagner and Z. Suo -- Stress-assisted copper-induced lateral growth of polycrystalline germanium / B. Hekmatshoar, D. Shahrjerdi, S. Mohajerzadeh, A. Khakifirooz, M. Robertson and A. Afzali-Kusha -- Stress relaxation during isothermal annealing at elevated temperatures in electroplated Cu films / Soo-Jung Hwang, Young-Chang Joo and Junichi Koike -- Stress and texture in sputter deposited Cr films / S. Yu Grachev, J.-D. Kamminga and G. C. A. M. Janssen -- Thickness dependent stress relaxation with the onset of L1[subscript 0] ordering in FePt thin films / K. W. Wierman, C. L. Platt and J. K. Howard -- Single-crystal and nano-columnar growth of gadolinium-doped ceria thin films on oxide substrates studies using electron microscopy / D. X. Huang, C. L. Chen and A. J. Jacobson -- Strain control in SrRuO[subscript 3] thin films by using a lattice constant tunable buffer / K. Terai, T. Ohnishi, M. Lippmaa, H. Koinuma and M. Kawasaki -- Thermal stability and internal stress for strongly (111) oriented Cu films / Sinji Takayama, Makato Oikawa and Tokuji Himuro -- Stress and defect generation in Si epitaxy / Tien Wang and Douglas Carlson -- Interdiffusion in coherent Si[subscript 0.90]Ge[subscript 0.10]/Si[subscript 0.95]Ge[subscript 0.05] superlattices / D. B. Aubertine and P. C. McIntyre -- In Situ investigation of growth of gold on crystalline TiO[subscript 2] and amorphous Al[subscript 2]O[subscript 3] substrates / L. Lauter and R. Abermann -- Formability of ultra-thin plasma-polymer films deposited on metal sheet : mesoscopic and nanoscopic aspects of defect formation / B. Baumert, M. Stratmann and M. Rohwerder -- Investigation of mechanical properties of mesoporous methyl-substituted SiO[subscript 2] thin films (methylsilesquioxane materials) / M. Verdier, M. Montagant, S. Maitrejean and G. Passemard -- In Situ, real-time curvature imaging during chemical vapor deposition / David A. Boyd, Ashok B. Tripathi, Mohamed El-Naggar and David G. Goodwin -- Microstructure evolution of on-substrate NiTi shape memory alloy thin films / Xi Wang, Ann Lai, Joost J. Vlassak and Yves Bellouard -- Guided formation of nanostructures in thin films / Wei Lu and Dongehoul Kim -- Probing strain fields about thin film structures using X-ray microdiffraction / C. E. Murray, I. C. Noyan, P. M. Mooney, B. Lai and Z. Cai -- Effects of the substrate on the determination of hardness of thin films by the nanoscratch and nanoindentation techniques : a comparative study for the cases of soft film on hard substrate and hard film on soft substrate / Noureddine Tayebi, Andreas A. Polycarpou and Thomas F. Conry -- Dislocation nucleation and segregation in nano-scale contact of stepped surfaces / H. H. Yu, P. Shrotriya, J. Wang and K.-S. Kim -- Determination of residual-stress-free state and mapping of residual stress fields using speckle interferometry and thermal relaxation / Dong-Won Kim, Jong-jin Kim, Dongil Son, Nak-Kyu Lee, Kyung-Hoan Na and Dongil Kwon -- Cracking and phase transformation in silicon during nanoindentation / Jae-il Jang, Songqing Wen, M. J. Lance, I. M. Anderson and G. M. Pharr -- Mechanisms controlling the hardness of Si and Ge / L. J. Vandeperre, F. Giuliani, S. J. Lloyd and W. J. Clegg -- Computational and experimental characterization of indentation creep / Ming Dao, Hidenari Takagi, Masami Fujiwara and Masahisa Otsuka -- Nanoindentation behavior of gold single crystals / Martha M. McCann and Sean G. Corcoran -- Indentation curve analysis for pile-up, sink-in and tip-blunting effects in sharp indentations / Yeol Choi, Baik-Woo Lee, Ho-Seung Lee and Dongil Kwon -- Determining stress-strain curves for thin films by experimental/computational nanoindentation / Baik-Woo Lee, Yeol Choi, Yun-Hee Lee, Ju-Young Kim and Dongil Kwon -- A theoretical study on the indentation of viscoelastic materials / Guanghui Fu --

ISBN

1558997334

Owning Institutions

Columbia University Libraries