Research Catalog

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / editors, P. Muralt ... [et al.].

Title
Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / editors, P. Muralt ... [et al.].

Items in the Library & Off-site

Filter by

1 Item

StatusFormatAccessCall NumberItem Location
Request for On-site UseRequest Scan
How do I pick up this item and when will it be ready?
TextUse in library TK7870.15 .M383 2003gOff-site

Details

Additional Authors
  • Materials Research Society.
  • Materials Research Society. Meeting (2003 : Boston, Mass.)
  • Muralt, P.
  • Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices (2003 : Boston, Mass.)
Description
xiii, 232 p. : ill.; 24 cm.
Series Statement
Materials Research Society symposium proceedings ; v. 783
Subject
Electronic packaging > Materials > Congresses
ISBN
1558997210
Owning Institutions
Columbia University Libraries