Research Catalog

Wafer bonding : applications and technology

Title
Wafer bonding : applications and technology / M. Alexe, U. Gösele (eds.).
Publication
Berlin ; New York : Springer-Verlag, [2004], ©2004.

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Details

Additional Authors
  • Alexe, M. (Marin)
  • Gösele, U.
Description
xv, 499 pages : illustrations (some color); 25 cm.
Series Statement
Springer series in materials science, 0933-033X ; 75
Uniform Title
Springer series in materials science ; v. 75.
Subjects
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
3540210490 (alk. paper)
LCCN
2004046626
OCLC
  • ocm54692566
  • SCSB-5066613
Owning Institutions
Columbia University Libraries