Research Catalog

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

Title
Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. / editors Ting Y. Tsui [and others].
Publication
Warrendale, Pennsylvania : Materials Research Society, 2006.

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Details

Additional Authors
Tsui, Ting Y.
Description
xvii, 462 pages : illustrations; 24 cm.
Series Statement
Materials Research Society symposium proceedings ; v. 914
Uniform Title
Materials Research Society symposia proceedings ; v. 914.
Subjects
Bibliography (note)
  • Includes bibliographical references and indexes.
OCLC
  • 71680369
  • ocm71680369
  • SCSB-5277037
Owning Institutions
Columbia University Libraries